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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    22-0503-21

    22-0503-21

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 4,355
    RFQ
    		22-0503-21

    Datasheet

         		0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-0503-31

    22-0503-31

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 4,439
    RFQ
    		22-0503-31

    Datasheet

         		0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-3508-211

    16-3508-211

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,129
    RFQ
    		16-3508-211

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-3508-311

    16-3508-311

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,328
    RFQ
    		16-3508-311

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-47-652-41-006000

    116-47-652-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,256
    RFQ
    		116-47-652-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0610-T-2

    HLS-0610-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,297
    RFQ
    		HLS-0610-T-2

    Datasheet

         		HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-1814-G-R

    APH-1814-G-R

    APH-1814-G-R

    Samtec Inc.

    		 3,712
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0514-G-R

    APH-0514-G-R

    APH-0514-G-R

    Samtec Inc.

    		 3,673
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1514-G-R

    APH-1514-G-R

    APH-1514-G-R

    Samtec Inc.

    		 2,225
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1714-G-R

    APH-1714-G-R

    APH-1714-G-R

    Samtec Inc.

    		 4,111
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0814-G-R

    APH-0814-G-R

    APH-0814-G-R

    Samtec Inc.

    		 2,876
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1614-G-R

    APH-1614-G-R

    APH-1614-G-R

    Samtec Inc.

    		 3,050
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0714-G-R

    APH-0714-G-R

    APH-0714-G-R

    Samtec Inc.

    		 4,622
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    111-47-952-41-001000

    111-47-952-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 2,956
    RFQ
    		111-47-952-41-001000

    Datasheet

         		111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-318-41-003000

    126-93-318-41-003000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,918
    RFQ
    		126-93-318-41-003000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-318-41-003000

    126-43-318-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,718
    RFQ
    		126-43-318-41-003000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-3513-11H

    36-3513-11H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,837
    RFQ
    		36-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-7440-10

    28-7440-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    		 3,029
    RFQ
    		28-7440-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-7770-10

    28-7770-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    		 4,638
    RFQ
    		28-7770-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-7850-10

    28-7850-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    		 3,100
    RFQ
    		28-7850-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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