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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    116-43-650-41-006000

    116-43-650-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,049
    RFQ
    		116-43-650-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APH-0530-T-H

    APH-0530-T-H

    APH-0530-T-H

    Samtec Inc.

    		 3,091
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1530-T-H

    APH-1530-T-H

    APH-1530-T-H

    Samtec Inc.

    		 4,308
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1130-T-H

    APH-1130-T-H

    APH-1130-T-H

    Samtec Inc.

    		 4,265
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1730-T-H

    APH-1730-T-H

    APH-1730-T-H

    Samtec Inc.

    		 3,401
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1630-T-H

    APH-1630-T-H

    APH-1630-T-H

    Samtec Inc.

    		 2,211
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1330-T-H

    APH-1330-T-H

    APH-1330-T-H

    Samtec Inc.

    		 4,853
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1230-T-H

    APH-1230-T-H

    APH-1230-T-H

    Samtec Inc.

    		 3,629
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    714-43-234-31-018000

    714-43-234-31-018000

    CONN IC DIP SOCKET 34POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,586
    RFQ
    		714-43-234-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 34 (2 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
    614-93-636-31-018000

    614-93-636-31-018000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,042
    RFQ
    		614-93-636-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-43-636-31-018000

    614-43-636-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,451
    RFQ
    		614-43-636-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
    28-C182-20

    28-C182-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,131
    RFQ
    		28-C182-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-C182-30

    28-C182-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,304
    RFQ
    		28-C182-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-C212-20

    28-C212-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,123
    RFQ
    		28-C212-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-C212-30

    28-C212-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,704
    RFQ
    		28-C212-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-C300-20

    28-C300-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,153
    RFQ
    		28-C300-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-C300-30

    28-C300-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,655
    RFQ
    		28-C300-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    612-41-432-41-004000

    612-41-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,814
    RFQ
    		612-41-432-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-41-632-41-004000

    612-41-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,106
    RFQ
    		612-41-632-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-91-432-41-004000

    612-91-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,087
    RFQ
    		612-91-432-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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