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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-652-41-006000

    116-43-652-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,995
    RFQ
    116-43-652-41-006000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-950-41-003000

    116-91-950-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,261
    RFQ
    116-91-950-41-003000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6820-90T

    40-6820-90T

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    3,322
    RFQ
    40-6820-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    40-6822-90T

    40-6822-90T

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    4,825
    RFQ
    40-6822-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    40-6823-90T

    40-6823-90T

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    3,158
    RFQ
    40-6823-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    104-13-636-41-770000

    104-13-636-41-770000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    2,318
    RFQ
    104-13-636-41-770000

    Datasheet

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    128-PGM13039-10

    128-PGM13039-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,117
    RFQ
    128-PGM13039-10

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0213-G-3

    HLS-0213-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,630
    RFQ
    HLS-0213-G-3

    Datasheet

    HLS Tube Active SIP 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-41-640-41-001000

    116-41-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,799
    RFQ
    116-41-640-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-640-41-001000

    116-91-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,105
    RFQ
    116-91-640-41-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-952-41-001000

    111-93-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    2,128
    RFQ
    111-93-952-41-001000

    Datasheet

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-952-41-001000

    111-43-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,326
    RFQ
    111-43-952-41-001000

    Datasheet

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-823-90C

    40-823-90C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,248
    RFQ
    40-823-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    124-93-328-41-002000

    124-93-328-41-002000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,260
    RFQ
    124-93-328-41-002000

    Datasheet

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-93-428-41-002000

    124-93-428-41-002000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    3,554
    RFQ
    124-93-428-41-002000

    Datasheet

    124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-93-628-41-002000

    124-93-628-41-002000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,991
    RFQ
    124-93-628-41-002000

    Datasheet

    124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-328-41-002000

    124-43-328-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,294
    RFQ
    124-43-328-41-002000

    Datasheet

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-428-41-002000

    124-43-428-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,498
    RFQ
    124-43-428-41-002000

    Datasheet

    124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-628-41-002000

    124-43-628-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,607
    RFQ
    124-43-628-41-002000

    Datasheet

    124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-162-31-018000

    714-43-162-31-018000

    CONN SOCKET SIP 62POS GOLD

    Mill-Max Manufacturing Corp.

    3,541
    RFQ
    714-43-162-31-018000

    Datasheet

    714 Bulk Active SIP 62 (1 x 62) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 713714715716717718719720...955Next»
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