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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APO-316-G-B

    APO-316-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,037
    RFQ
    		APO-316-G-B

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0614-G-T

    APH-0614-G-T

    APH-0614-G-T

    Samtec Inc.

    		 4,485
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0414-G-T

    APH-0414-G-T

    APH-0414-G-T

    Samtec Inc.

    		 2,311
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1614-G-T

    APH-1614-G-T

    APH-1614-G-T

    Samtec Inc.

    		 2,102
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    614-93-642-31-018000

    614-93-642-31-018000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,578
    RFQ
    		614-93-642-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-642-31-018000

    614-43-642-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,579
    RFQ
    		614-43-642-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-628-ZHGG

    ICA-628-ZHGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,164
    RFQ
    		ICA-628-ZHGG

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    546-83-145-15-081135

    546-83-145-15-081135

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    		 3,082
    RFQ
    		546-83-145-15-081135

    Datasheet

         		546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-145-15-081136

    546-83-145-15-081136

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    		 3,920
    RFQ
    		546-83-145-15-081136

    Datasheet

         		546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    34-6621-30

    34-6621-30

    CONN IC DIP SOCKET 34POS TIN

    Aries Electronics

    		 2,351
    RFQ
    		34-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    69-PGM11030-11

    69-PGM11030-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,999
    RFQ
    		69-PGM11030-11

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    69-PGM11031-11

    69-PGM11031-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,942
    RFQ
    		69-PGM11031-11

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    69-PGM11053-11

    69-PGM11053-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,708
    RFQ
    		69-PGM11053-11

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    132-PGM14016-10

    132-PGM14016-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,715
    RFQ
    		132-PGM14016-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-640-41-003000

    612-41-640-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,449
    RFQ
    		612-41-640-41-003000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-640-41-003000

    612-91-640-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,105
    RFQ
    		612-91-640-41-003000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-640-41-770000

    104-13-640-41-770000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,178
    RFQ
    		104-13-640-41-770000

    Datasheet

         		104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    116-41-650-41-008000

    116-41-650-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,573
    RFQ
    		116-41-650-41-008000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-008000

    116-91-650-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,332
    RFQ
    		116-91-650-41-008000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1818-G-T

    APH-1818-G-T

    APH-1818-G-T

    Samtec Inc.

    		 3,940
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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