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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    299-43-324-10-001000

    299-43-324-10-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 85
    RFQ
    		299-43-324-10-001000

    Datasheet

         		299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-324-10-001000

    299-93-324-10-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 25
    RFQ
    		299-93-324-10-001000

    Datasheet

         		299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-049-07-000001

    510-93-049-07-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 6
    RFQ
    		510-93-049-07-000001

    Datasheet

         		510 Tube Active DIP, 0.1" (2.54mm) Row Spacing 49 (7 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-640-41-801000

    123-93-640-41-801000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 10
    RFQ
    		123-93-640-41-801000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-964-41-001000

    123-43-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 86
    RFQ
    		123-43-964-41-001000

    Datasheet

         		123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    44-3572-11

    44-3572-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 50
    RFQ
    		44-3572-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3573-11

    44-3573-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 47
    RFQ
    		44-3573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    210-83-308-41-101000

    210-83-308-41-101000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 27
    RFQ

    -

    		 210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-308-41-530000

    110-83-308-41-530000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 21
    RFQ
    		110-83-308-41-530000

    Datasheet

         		110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-316-41-530000

    110-83-316-41-530000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 49
    RFQ

    -

    		 110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-318-41-530000

    110-83-318-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 21
    RFQ
    		110-83-318-41-530000

    Datasheet

         		110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-628-41-530000

    110-83-628-41-530000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 50
    RFQ

    -

    		 110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    CAP-002-01-00

    CAP-002-01-00

    0603 Capacitor Test Socket

    MiS Technologies

    		 17
    RFQ
    		CAP-002-01-00

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    S582-11-898-15-001414

    S582-11-898-15-001414

    898 POS BGA SOCKET .050

    Mill-Max Manufacturing Corp.

    		 3
    RFQ

    -

    		 - Bulk Active - - - - - - - - - - - - - - -
    S530-10-898-15-001406

    S530-10-898-15-001406

    898 POS BGA HEADER .050

    Mill-Max Manufacturing Corp.

    		 5
    RFQ

    -

    		 - Bulk Active - - - - - - - - - - - - - - -
    108493-0014

    108493-0014

    DDR Socket, 96 BGA 7.5 mm x 13.1

    Ironwood Electronics

    		 25
    RFQ
    		108493-0014

    Datasheet

         		Grypper Bag Active BGA 96 (9 x 16) 0.031" (0.80mm) - - - - - Solder - - - - - -
    108493-0015

    108493-0015

    DDR Socket, 96 BGA 7.5 mm x 13.1

    Ironwood Electronics

    		 25
    RFQ
    		108493-0015

    Datasheet

         		Grypper Bag Active BGA 96 (9 x 16) 0.031" (0.80mm) - - - - - Solder - - - - - -
    107022-0048

    107022-0048

    DDR Socket, 78 BGA 7.5 mm x 10.6

    Ironwood Electronics

    		 23
    RFQ
    		107022-0048

    Datasheet

         		Grypper Bag Active BGA 78 (6 x 13) 0.031" (0.80mm) - - - - - Solder - - - - - -
    108387-0059

    108387-0059

    Socket-eMMC/UFS, 153 BGA 10.0 mm

    Ironwood Electronics

    		 23
    RFQ
    		108387-0059

    Datasheet

         		- Bag Active BGA 153 (12 x 13) 0.020" (0.50mm) - - - Through Hole - Solder 0.020" (0.50mm) - - - - -
    107250-0026

    107250-0026

    Socket-eMMC/UFS, 153 BGA 11.5 mm

    Ironwood Electronics

    		 21
    RFQ
    		107250-0026

    Datasheet

         		- Bag Active BGA 153 (12 x 13) 0.020" (0.50mm) - - - Through Hole - Solder 0.020" (0.50mm) - - - - -
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