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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-93-324-61-001000

    115-93-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,719
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-424-61-001000

    115-93-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,454
    RFQ

    -

    		 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-624-61-001000

    115-93-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,115
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-432-41-001000

    612-13-432-41-001000

    SOCKET CARRIER SLDRTL .400 32POS

    Mill-Max Manufacturing Corp.

    		 2,211
    RFQ
    		612-13-432-41-001000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-632-41-001000

    612-13-632-41-001000

    SOCKET CARRIER SLDRTL .600 32POS

    Mill-Max Manufacturing Corp.

    		 2,711
    RFQ
    		612-13-632-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-308-61-003000

    115-44-308-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,921
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    192-PGM17025-10

    192-PGM17025-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,471
    RFQ
    		192-PGM17025-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    257-PGM20012-10

    257-PGM20012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,595
    RFQ
    		257-PGM20012-10

    Datasheet

         		PGM Bulk Obsolete PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-44-648-61-001000

    110-44-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,560
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-648-61-001000

    110-99-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,014
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-648-41-001000

    123-43-648-41-001000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,390
    RFQ
    		123-43-648-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-652-31-012000

    614-93-652-31-012000

    SOCKET CARRIER LOWPRO .600 52POS

    Mill-Max Manufacturing Corp.

    		 4,908
    RFQ
    		614-93-652-31-012000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-652-31-012000

    614-43-652-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,367
    RFQ
    		614-43-652-31-012000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    35-0501-31

    35-0501-31

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    		 3,112
    RFQ
    		35-0501-31

    Datasheet

         		501 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    614-93-950-31-018000

    614-93-950-31-018000

    SOCKET CARRIER LOWPRO .900 50POS

    Mill-Max Manufacturing Corp.

    		 3,462
    RFQ
    		614-93-950-31-018000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-950-31-018000

    614-43-950-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,971
    RFQ
    		614-43-950-31-018000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-310-61-001000

    115-93-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,472
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-420-61-003000

    115-43-420-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,449
    RFQ

    -

    		 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-420-61-003000

    115-93-420-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,826
    RFQ

    -

    		 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-6503-21

    30-6503-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 3,781
    RFQ
    		30-6503-21

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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