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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-306-61-007000

    116-43-306-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,111
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-652-41-001000

    126-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,831
    RFQ
    		126-93-652-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-652-41-001000

    126-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,824
    RFQ
    		126-43-652-41-001000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1840-T-T

    APH-1840-T-T

    APH-1840-T-T

    Samtec Inc.

    		 2,627
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1540-T-T

    APH-1540-T-T

    APH-1540-T-T

    Samtec Inc.

    		 2,663
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1740-T-T

    APH-1740-T-T

    APH-1740-T-T

    Samtec Inc.

    		 3,435
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    614-93-650-41-001000

    614-93-650-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,186
    RFQ
    		614-93-650-41-001000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-650-41-001000

    614-43-650-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,621
    RFQ
    		614-43-650-41-001000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6508-20

    48-6508-20

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,552
    RFQ
    		48-6508-20

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    48-6508-30

    48-6508-30

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 3,894
    RFQ
    		48-6508-30

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-13-432-41-001000

    123-13-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,814
    RFQ
    		123-13-432-41-001000

    Datasheet

         		123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-632-41-001000

    123-13-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,386
    RFQ
    		123-13-632-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-642-41-004000

    612-43-642-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,492
    RFQ
    		612-43-642-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-642-41-004000

    612-93-642-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,300
    RFQ
    		612-93-642-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-175-16-072112

    614-87-175-16-072112

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    		 3,024
    RFQ
    		614-87-175-16-072112

    Datasheet

         		614 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-13-624-41-801000

    123-13-624-41-801000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,219
    RFQ
    		123-13-624-41-801000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-652-41-001000

    123-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,025
    RFQ
    		123-93-652-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-652-41-001000

    123-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,470
    RFQ
    		123-43-652-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    34-0508-21

    34-0508-21

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    		 2,273
    RFQ
    		34-0508-21

    Datasheet

         		508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-0508-31

    34-0508-31

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    		 4,958
    RFQ
    		34-0508-31

    Datasheet

         		508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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