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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
243-28-1-06CONN IC DIP SOCKET 28POS TIN |
1,524 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 100.0µin (2.54µm) | Phosphor Bronze |
|
1-2199298-6CONN IC DIP SOCKET 20POS TIN |
2,473 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Brass, Copper |
|
D01-9970242CONN SOCKET SIP 2POS GOLD |
16,032 |
|
Datasheet |
D01-997 | Bag | Active | SIP | 2 (1 x 2) | Gold | Flash | Beryllium Copper | Threaded | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
XR2C-0311-NCONN SOCKET SIP 3POS GOLD |
3,654 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
245-24-1-06CONN IC DIP SOCKET 24POS TIN |
2,060 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Phosphor Bronze |
|
110-44-306-41-001000CONN IC DIP SOCKET 6POS TIN |
1,701 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
AR 08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD |
6,895 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
D01-9970642CONN SOCKET SIP 6POS GOLD |
28,251 |
|
Datasheet |
D01-997 | Tube | Active | SIP | 6 (1 x 6) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
AR 20-HZL-TTCONN IC DIP SOCKET 20POS TIN |
1,980 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
245-28-1-06CONN IC DIP SOCKET 28POS TIN |
1,068 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Phosphor Bronze |
|
D01-9970542CONN SOCKET SIP 5POS GOLD |
2,593 |
|
Datasheet |
D01-997 | Tube | Active | SIP | 5 (1 x 5) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
210-1-08-003CONN IC DIP SOCKET 8POS GOLD |
2,927 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
4808-3000-CPCONN IC DIP SOCKET 8POS TIN |
24,688 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
243-40-1-06CONN IC DIP SOCKET 40POS TIN |
1,711 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 100.0µin (2.54µm) | Phosphor Bronze |
|
4816-3000-CPCONN IC DIP SOCKET 16POS TIN |
11,180 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
4814-3004-CPCONN IC DIP SOCKET 14POS TIN |
9,841 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
4814-3000-CPCONN IC DIP SOCKET 14POS TIN |
8,797 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
SA103000CONN IC DIP SOCKET 10POS GOLD |
3,976 |
|
Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
110-99-308-41-001000CONN IC DIP SOCKET 8POS TIN-LEAD |
2,011 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
1-2199298-8CONN IC DIP SOCKET 24POS TIN |
1,238 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Brass, Copper |
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