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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1736-G-T

    APH-1736-G-T

    APH-1736-G-T

    Samtec Inc.

    		 4,366
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APA-648-G-P

    APA-648-G-P

    ADAPTER PLUG

    Samtec Inc.

    		 3,993
    RFQ
    		APA-648-G-P

    Datasheet

         		APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    40-3570-11

    40-3570-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 4,867
    RFQ
    		40-3570-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3571-11

    40-3571-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 4,357
    RFQ
    		40-3571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3573-11

    40-3573-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 2,181
    RFQ
    		40-3573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3575-11

    40-3575-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 4,839
    RFQ
    		40-3575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-11

    40-6574-11

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,649
    RFQ
    		40-6574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3574-11

    40-3574-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 4,729
    RFQ
    		40-3574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6573-11

    40-6573-11

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,698
    RFQ
    		40-6573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-650-61-001000

    116-93-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,303
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0910-G-2

    HLS-0910-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,420
    RFQ
    		HLS-0910-G-2

    Datasheet

         		HLS Bulk Active SIP 90 (9 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    514-83-257-20-111117

    514-83-257-20-111117

    CONN SOCKET PGA 257POS GOLD

    Preci-Dip

    		 3,195
    RFQ
    		514-83-257-20-111117

    Datasheet

         		514 Bulk Active PGA 257 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    517-83-447-20-121111

    517-83-447-20-121111

    CONN SOCKET PGA 447POS GOLD

    Preci-Dip

    		 3,713
    RFQ
    		517-83-447-20-121111

    Datasheet

         		517 Bulk Active PGA 447 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-640-G-B

    APO-640-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,979
    RFQ
    		APO-640-G-B

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-43-964-61-003000

    116-43-964-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,754
    RFQ

    -

    		 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-003000

    116-93-964-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,835
    RFQ

    -

    		 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    88-PGM13028-10H

    88-PGM13028-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,909
    RFQ
    		88-PGM13028-10H

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-87-279-19-081112

    614-87-279-19-081112

    CONN SOCKET PGA 279POS GOLD

    Preci-Dip

    		 2,042
    RFQ
    		614-87-279-19-081112

    Datasheet

         		614 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0528-G-H

    APH-0528-G-H

    APH-0528-G-H

    Samtec Inc.

    		 2,483
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1628-G-H

    APH-1628-G-H

    APH-1628-G-H

    Samtec Inc.

    		 4,292
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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