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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    121-PLS13121-12

    121-PLS13121-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,807
    RFQ
    121-PLS13121-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    121-PRS13121-12

    121-PRS13121-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,907
    RFQ
    121-PRS13121-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    80-PRS21027-12

    80-PRS21027-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,111
    RFQ
    80-PRS21027-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    558-10-576M30-001104

    558-10-576M30-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    2,837
    RFQ
    558-10-576M30-001104

    Datasheet

    558 Bulk Active BGA 576 (30 x 30) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    132-PLS14016-12

    132-PLS14016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,852
    RFQ
    132-PLS14016-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    518-77-576M30-001105

    518-77-576M30-001105

    CONN SOCKET PGA 576POS GOLD

    Preci-Dip

    3,748
    RFQ
    518-77-576M30-001105

    Datasheet

    518 Bulk Active PGA 576 (30 x 30) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    1017-2-0256-0B-01

    1017-2-0256-0B-01

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    2,182
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    550-10-652M35-001152

    550-10-652M35-001152

    BGA SOLDER TAIL

    Preci-Dip

    3,667
    RFQ
    550-10-652M35-001152

    Datasheet

    550 Bulk Active BGA 652 (35 x 35) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    200-6321-9UN-1900

    200-6321-9UN-1900

    CONN SOCKET PGA ZIF 441POS GOLD

    3M

    1
    RFQ
    200-6321-9UN-1900

    Datasheet

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 441 (21 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 150°C Gold Polyethersulfone (PES) 30.0µin (0.76µm) Beryllium Copper
    100-PLS17048-12

    100-PLS17048-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,791
    RFQ
    100-PLS17048-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    100-PLS17049-12

    100-PLS17049-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,953
    RFQ
    100-PLS17049-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    100-PRS17048-12

    100-PRS17048-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,394
    RFQ
    100-PRS17048-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    100-PRS17049-12

    100-PRS17049-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,109
    RFQ
    100-PRS17049-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    235-3019-02-0602

    235-3019-02-0602

    CONN ZIG-ZAG ZIF 35POS GOLD

    3M

    4,366
    RFQ
    235-3019-02-0602

    Datasheet

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
    24-3575-18

    24-3575-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,498
    RFQ
    24-3575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    24-6575-18

    24-6575-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,395
    RFQ
    24-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    518-77-576M30-001106

    518-77-576M30-001106

    CONN SOCKET PGA 576POS GOLD

    Preci-Dip

    3,478
    RFQ
    518-77-576M30-001106

    Datasheet

    518 Bulk Active PGA 576 (30 x 30) Gold Flash Beryllium Copper Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
    144-PLS15026-12

    144-PLS15026-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,208
    RFQ
    144-PLS15026-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    144-PRS15026-12

    144-PRS15026-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,608
    RFQ
    144-PRS15026-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    145-PRS15058-12

    145-PRS15058-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,412
    RFQ
    145-PRS15058-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
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