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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
32-3551-18CONN IC DIP SOCKET ZIF 32POS |
2,176 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
32-3552-18CONN IC DIP SOCKET ZIF 32POS |
2,384 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
32-3553-18CONN IC DIP SOCKET ZIF 32POS |
3,392 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
32-6552-18CONN IC DIP SOCKET ZIF 32POS |
4,808 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
32-6553-18CONN IC DIP SOCKET ZIF 36POS TIN |
2,860 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
|
32-3554-18CONN IC DIP SOCKET ZIF 32POS |
3,880 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
32-6554-18CONN IC DIP SOCKET ZIF 32POS |
2,818 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
48-6571-18CONN IC DIP SOCKET ZIF 48POS |
3,450 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
71002651433MTEXTOOTEST & BURN-IN BALL GRID |
3,797 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
42-6551-18CONN IC DIP SOCKET ZIF 42POS |
3,634 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
42-6553-18CONN IC DIP SOCKET ZIF 42POS |
4,778 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
42-3554-18CONN IC DIP SOCKET ZIF 42POS |
4,987 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
42-6554-18CONN IC DIP SOCKET ZIF 42POS |
2,601 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
223-PLS18017-12CONN SOCKET PGA ZIF GOLD |
2,044 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
223-PLS18039-12CONN SOCKET PGA ZIF GOLD |
3,419 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
223-PRS18017-12CONN SOCKET PGA ZIF GOLD |
2,961 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
223-PRS18039-12CONN SOCKET PGA ZIF GOLD |
2,547 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
2256-9308-01-24013M TEXTOOL 2256-9308-01-2401 PP1 |
4,856 |
|
- |
Textool™ | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
225-PRS17007-12CONN SOCKET PGA ZIF GOLD |
2,635 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
225-PRS18003-12CONN SOCKET PGA ZIF GOLD |
2,609 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
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