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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD4300SNL10SOLDER PASTE WATER SOL LF 10CC Chip Quik Inc. |
0 |
|
Datasheet |
CHIPQUIK® SMD4300 | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDIN52SN48-RINDIUM SOLDER RIBBON (IN52/SN48) Chip Quik Inc. |
1 |
|
Datasheet |
SMD | Bulk | Active | Ribbon Solder | In52Sn48 (52/48) | - | 244°F (118°C) | - | - | - | Lead Free | Spool | - | - | - |
|
NC2SWLF.031 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
0 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
CQB-AU100-20UMGOLD BONDING WIRE (AU100) GOLD 2 Chip Quik Inc. |
1 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Wire Solder | Au100 (100) | 0.001" (0.02mm) | 1947°F (1064°C) | - | - | - | - | Spool | 12 Months | Date of Manufacture | - |
|
NC2SWLF.020 0.3OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
16 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | - | Tube, 0.3 oz (8.51g) | - | - | - |
|
NC2SW.031 0.5OZSOLDER WIRE MINI POCKET PACK 60/ Chip Quik Inc. |
0 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.50 oz (14.17g) | - | - | - |
|
NC2SW.020 0.3OZSOLDER WIRE MINI POCKET PACK 60/ Chip Quik Inc. |
16 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - | - |
|
NC4SW.031 0.5OZSOLDER WIRE MINI POCKET PACK 93. Chip Quik Inc. |
15 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.50 oz (14.17g) | - | - | - |
|
NC4SW.020 0.3OZSOLDER WIRE MINI POCKET PACK 93. Chip Quik Inc. |
9 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.020" (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - | - |
|
RASW.031 .7OZSOLDER WIRE POCKET PACK 63/37 TI Chip Quik Inc. |
11 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - | - |
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