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    Heat Sinks

    制造商 Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    642-60AB

    642-60AB

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    4,576
    RFQ
    642-60AB

    Datasheet

    642 Bulk Active Top Mount BGA Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) Thermal Tape, Adhesive (Not Included) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    529902B02100G

    529902B02100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,548
    RFQ
    529902B02100G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 6.0W @ 30°C 1.50°C/W @ 500 LFM 4.50°C/W Aluminum Black Anodized
    HSE-B20635-035H-W

    HSE-B20635-035H-W

    HEAT SINK, EXTRUSION, TO-220, 63

    Same Sky (Formerly CUI Devices)

    4,009
    RFQ
    HSE-B20635-035H-W

    Datasheet

    HSE Box Active Board Level, Vertical TO-220 Rectangular, Angled Fins 2.500" (63.50mm) 1.378" (35.00mm) - 0.500" (12.70mm) Bolt On and PC Pin 9.2W @ 75°C 4.35°C/W @ 200 LFM 8.15°C/W Aluminum Alloy Black Anodized
    533722B02552G

    533722B02552G

    HEAT SINK

    Boyd Laconia, LLC

    4,402
    RFQ
    533722B02552G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 (Dual) Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) Clip and PC Pin 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.70°C/W Aluminum Black Anodized
    HSE-B630-04H

    HSE-B630-04H

    HEAT SINK, EXTRUSION, TO-220, 63

    Same Sky (Formerly CUI Devices)

    4,982
    RFQ
    HSE-B630-04H

    Datasheet

    HSE Box Active Board Level, Vertical TO-220 Rectangular, Fins 2.480" (63.00mm) 1.378" (35.00mm) - 1.000" (25.40mm) Bolt On and PC Pin 14.4W @ 75°C 2.31°C/W @ 200 LFM 9.37°C/W Aluminum Alloy Black Anodized
    ATS-PCBM1103

    ATS-PCBM1103

    BOARD LEVEL HEAT SINK

    Advanced Thermal Solutions Inc.

    3,702
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin - 1.50°C/W @ 200 LFM 4.70°C/W Aluminum Black Anodized
    HSE-B18508-035H-03

    HSE-B18508-035H-03

    HEAT SINK, EXTRUSION, TO-218, 50

    Same Sky (Formerly CUI Devices)

    4,567
    RFQ
    HSE-B18508-035H-03

    Datasheet

    HSE Box Active Board Level, Vertical TO-218 Rectangular, Angled Fins 2.000" (50.80mm) 1.638" (41.60mm) - 0.984" (25.00mm) Clip and PC Pin 13.0W @ 75°C 3.44°C/W @ 200 LFM 5.77°C/W Aluminum Alloy Black Anodized
    624-25ABT5

    624-25ABT5

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    3,728
    RFQ
    624-25ABT5

    Datasheet

    624 Bulk Active Top Mount BGA Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) Thermal Tape, Adhesive (Included) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
    634-20AB

    634-20AB

    HEATSINK TO-220 VERT MT BLK 2.0"

    Wakefield-Vette

    2,940
    RFQ
    634-20AB

    Datasheet

    634 Bulk Active Board Level, Vertical TO-220, TO-218 Rectangular, Fins 2.000" (50.80mm) 0.640" (16.26mm) - 0.640" (16.26mm) Bolt On - - - Aluminum Black Anodized
    TGH-0160-01

    TGH-0160-01

    ALUMINIUM HEAT SINK 16X16MM

    t-Global Technology

    14
    RFQ
    TGH-0160-01

    Datasheet

    TGH Bulk Obsolete Top Mount - Square, Fins 0.630" (16.00mm) 0.630" (16.00mm) - 0.433" (11.00mm) - - - - Aluminum Clean Anodized
    624-45AB-T4E

    624-45AB-T4E

    HEATSINK CPU 21MM SQ

    Wakefield-Vette

    4,519
    RFQ
    624-45AB-T4E

    Datasheet

    624 Bulk Active Top Mount BGA Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.450" (11.43mm) Thermal Tape, Adhesive (Included) - 15.00°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-PCBM1100

    ATS-PCBM1100

    BOARD LEVEL HEAT SINK

    Advanced Thermal Solutions Inc.

    2,770
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin - 3.10°C/W @ 200 LFM 3.90°C/W Aluminum Black Anodized
    642-35ABT1E

    642-35ABT1E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    4,294
    RFQ
    642-35ABT1E

    Datasheet

    642 Bulk Active Top Mount BGA Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) Thermal Tape, Adhesive (Not Included) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    642-35ABT4E

    642-35ABT4E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    2,161
    RFQ
    642-35ABT4E

    Datasheet

    642 Bulk Active Top Mount BGA Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) Thermal Tape, Adhesive (Not Included) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    594302B02853G

    594302B02853G

    HEATSINK TO-220 W/KOOL CLIP BLK

    Boyd Laconia, LLC

    4,925
    RFQ
    594302B02853G

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) - 0.480" (12.19mm) Clip and Board Locks 6.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum Black Anodized
    V2200N1-F-LP

    V2200N1-F-LP

    HEATSINK CPU W/ADHESIVE STAMPED

    Assmann WSW Components

    4,138
    RFQ
    V2200N1-F-LP

    Datasheet

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.512" (13.00mm) Thermal Tape, Adhesive (Included) - - - Aluminum Alloy Natural Anodized
    6038DG

    6038DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,915
    RFQ
    6038DG

    Datasheet

    - Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Clip and PC Pin 2.0W @ 40°C 8.00°C/W @ 500 LFM 18.00°C/W Aluminum Tin
    V2201N1-LP

    V2201N1-LP

    HEATSINK CPU STAMPED

    Assmann WSW Components

    2,162
    RFQ
    V2201N1-LP

    Datasheet

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.457" (37.00mm) 1.457" (37.00mm) - 0.551" (14.00mm) Thermal Tape, Adhesive (Not Included) - - - Aluminum Alloy Natural Anodized
    HSE-B18635-035H

    HSE-B18635-035H

    HEAT SINK, EXTRUSION,TO-218, 63.

    Same Sky (Formerly CUI Devices)

    3,065
    RFQ
    HSE-B18635-035H

    Datasheet

    HSE Box Active Board Level, Vertical TO-218 Rectangular, Angled Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) Bolt On and PC Pin 16.7W @ 75°C 2.24°C/W @ 200 LFM 4.49°C/W Aluminum Alloy Black Anodized
    HSE-B18635-035H-04

    HSE-B18635-035H-04

    HEAT SINK, EXTRUSION, TO-218, 63

    Same Sky (Formerly CUI Devices)

    3,839
    RFQ
    HSE-B18635-035H-04

    Datasheet

    HSE Box Active Board Level, Vertical TO-218 Rectangular, Angled Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) Clip and PC Pin 15.1W @ 75°C 2.38°C/W @ 200 LFM 4.97°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 22132214221522162217221822192220...6110Next»
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