Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Heat Sinks

    制造商 Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish

















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    OMNI-UNI-27-50

    OMNI-UNI-27-50

    HEATSINK TO-247 TO-264 TO-220

    Wakefield-Vette

    4,480
    RFQ
    OMNI-UNI-27-50

    Datasheet

    OmniKlip™ Bulk Active Board Level, Vertical TO-220, TO-247, TO-264 Rectangular, Fins 1.969" (50.00mm) 1.063" (27.00mm) - 1.969" (50.00mm) Clip, Solder Foot - - - Aluminum Black Anodized
    528-45AB-T725

    528-45AB-T725

    HEATSINK DC/DC HALF BRICK VERT

    Wakefield-Vette

    2,075
    RFQ
    528-45AB-T725

    Datasheet

    528 Bulk Active Board Level, Vertical Half Brick DC/DC Converter Rectangular, Fins 2.400" (60.96mm) 2.280" (57.91mm) - 0.450" (11.43mm) Bolt On, Thermal Material 7.0W @ 60°C 2.10°C/W @ 300 LFM - Aluminum Black Anodized
    662-15AG

    662-15AG

    HEATSINK EXTRUSION 45MM

    Wakefield-Vette

    3,942
    RFQ
    662-15AG

    Datasheet

    662 Bulk Active Top Mount BGA Square, Pin Fins 1.713" (43.51mm) 1.713" (43.51mm) - 0.150" (3.81mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum Gold Iridite
    601K

    601K

    HEATSINK FOR TO66

    Wakefield-Vette

    2,482
    RFQ
    601K

    Datasheet

    601 Bulk Active Board Level TO-66 Rectangular, Fins 2.000" (50.80mm) 1.250" (31.75mm) - 0.562" (14.28mm) Thermal Tape, Adhesive (Not Included) 5.0W @ 50°C 5.85°C/W @ 100 LFM - Aluminum Black Anodized
    7140DG

    7140DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,585
    RFQ
    7140DG

    Datasheet

    - Bulk Active Board Level TO-220 Rectangular, Fins 0.700" (17.78mm) 0.900" (22.86mm) - 0.375" (9.52mm) Clip and PC Pin 1.5W @ 50°C 10.00°C/W @ 200 LFM 20.80°C/W Copper Tin
    660-29ABT4E

    660-29ABT4E

    HEATSINK EXTRUSION 37MM

    Wakefield-Vette

    4,479
    RFQ
    660-29ABT4E

    Datasheet

    660 Bulk Active Top Mount BGA Square, Pin Fins 1.530" (38.86mm) 1.530" (38.86mm) - 0.285" (7.24mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 7.00°C/W @ 100 LFM - Aluminum Black Anodized
    ATS-P1-165-C2-R0

    ATS-P1-165-C2-R0

    HEATSINK 25X25X10MM R-TAB T766

    Advanced Thermal Solutions Inc.

    3,637
    RFQ
    ATS-P1-165-C2-R0

    Datasheet

    pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) Push Pin - 18.36°C/W @ 100 LFM - Aluminum Blue Anodized
    DA-T268-401E-TR

    DA-T268-401E-TR

    TO-268 SMD HEAT SINK ANODZD

    Ohmite

    2,750
    RFQ
    DA-T268-401E-TR

    Datasheet

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.460" (11.68mm) Solderable Feet 9.0W @ 43°C 5°C/W @ 500 LFM - Aluminum Black Anodized
    547-95AB

    547-95AB

    HEATSINK DC/DC QUARTER BRICK

    Wakefield-Vette

    3,841
    RFQ
    547-95AB

    Datasheet

    547 Bulk Active Board Level, Vertical Quarter Brick DC/DC Converter Rectangular, Fins 1.450" (36.83mm) 2.280" (57.91mm) - 0.950" (24.13mm) Bolt On, Thermal Material - 2.20°C/W @ 300 LFM - Aluminum Black Anodized
    662-15ABT3

    662-15ABT3

    HEATSINK EXTRUSION 45MM

    Wakefield-Vette

    2,955
    RFQ
    662-15ABT3

    Datasheet

    662 Bulk Active Top Mount BGA Square, Pin Fins 1.713" (43.51mm) 1.713" (43.51mm) - 0.150" (3.81mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum Black Anodized
    326005R00000G

    326005R00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,252
    RFQ
    326005R00000G

    Datasheet

    - Bulk Active Board Level TO-5 Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.375" (9.52mm) Press Fit 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Aluminum Red Anodized
    659-65ABT4E

    659-65ABT4E

    HEATSINK EXTRUSION 37MM

    Wakefield-Vette

    4,392
    RFQ
    659-65ABT4E

    Datasheet

    659 Bulk Active Top Mount BGA Square, Pin Fins 1.450" (36.83mm) 1.450" (36.83mm) - 0.650" (16.51mm) Thermal Tape, Adhesive (Included) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum Black Anodized
    591202B03100G

    591202B03100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,203
    RFQ
    591202B03100G

    Datasheet

    - Bulk Active Board Level TO-220, TO-262 Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and PC Pin 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
    660-29ABT5

    660-29ABT5

    HEATSINK EXTRUSION 37MM

    Wakefield-Vette

    2,840
    RFQ
    660-29ABT5

    Datasheet

    660 Bulk Active Top Mount BGA Square, Pin Fins 1.530" (38.86mm) 1.530" (38.86mm) - 0.285" (7.24mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 7.00°C/W @ 100 LFM - Aluminum Black Anodized
    501906B00000G

    501906B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,594
    RFQ
    501906B00000G

    Datasheet

    - Bulk Active Board Level TO-66 Rhombus 1.550" (39.37mm) 1.040" (26.42mm) - 1.000" (25.40mm) Bolt On 4.0W @ 40°C 4.00°C/W @ 300 LFM 8.00°C/W Aluminum Black Anodized
    374124B00032G

    374124B00032G

    BGA,374124B00032G

    Boyd Laconia, LLC

    2,450
    RFQ

    -

    - Bulk Active Top Mount BGA Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) Thermal Tape, Adhesive (Included) - 7.39°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
    662-15AGT3

    662-15AGT3

    HEATSINK EXTRUSION 45MM

    Wakefield-Vette

    2,469
    RFQ
    662-15AGT3

    Datasheet

    662 Bulk Active Top Mount BGA Square, Pin Fins 1.713" (43.51mm) 1.713" (43.51mm) - 0.150" (3.81mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum Gold Iridite
    662-15AGT5

    662-15AGT5

    HEATSINK EXTRUSION 45MM

    Wakefield-Vette

    2,996
    RFQ
    662-15AGT5

    Datasheet

    662 Bulk Active Top Mount BGA Square, Pin Fins 1.713" (43.51mm) 1.713" (43.51mm) - 0.150" (3.81mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum Gold Iridite
    BDN17-3CB/A01

    BDN17-3CB/A01

    HEATSINK CPU W/ADHESIVE 1.71"SQ

    CTS Thermal Management Products

    2,572
    RFQ
    BDN17-3CB/A01

    Datasheet

    BDN Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.710" (43.43mm) 1.710" (43.43mm) - 0.355" (9.02mm) Thermal Tape, Adhesive (Included) - 3.80°C/W @ 400 LFM 11.50°C/W Aluminum Black Anodized
    0372505020

    0372505020

    CHIPSET COOLER #2 COPPER 6500RPM

    Molex

    4,874
    RFQ

    -

    - Bulk Obsolete - - - - - - - - - - - - -
    Total 122183 Record«Prev1... 22292230223122322233223422352236...6110Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER