| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Package Cooled | Shape | Length | Width | Diameter | Fin Height | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
OMNI-UNI-27-50HEATSINK TO-247 TO-264 TO-220 |
4,480 |
|
Datasheet |
OmniKlip™ | Bulk | Active | Board Level, Vertical | TO-220, TO-247, TO-264 | Rectangular, Fins | 1.969" (50.00mm) | 1.063" (27.00mm) | - | 1.969" (50.00mm) | Clip, Solder Foot | - | - | - | Aluminum | Black Anodized |
|
528-45AB-T725HEATSINK DC/DC HALF BRICK VERT |
2,075 |
|
Datasheet |
528 | Bulk | Active | Board Level, Vertical | Half Brick DC/DC Converter | Rectangular, Fins | 2.400" (60.96mm) | 2.280" (57.91mm) | - | 0.450" (11.43mm) | Bolt On, Thermal Material | 7.0W @ 60°C | 2.10°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
662-15AGHEATSINK EXTRUSION 45MM |
3,942 |
|
Datasheet |
662 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.713" (43.51mm) | 1.713" (43.51mm) | - | 0.150" (3.81mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 8.00°C/W @ 200 LFM | - | Aluminum | Gold Iridite |
|
601KHEATSINK FOR TO66 |
2,482 |
|
Datasheet |
601 | Bulk | Active | Board Level | TO-66 | Rectangular, Fins | 2.000" (50.80mm) | 1.250" (31.75mm) | - | 0.562" (14.28mm) | Thermal Tape, Adhesive (Not Included) | 5.0W @ 50°C | 5.85°C/W @ 100 LFM | - | Aluminum | Black Anodized |
|
7140DGBOARD LEVEL HEAT SINK |
4,585 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-220 | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | - | 0.375" (9.52mm) | Clip and PC Pin | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Copper | Tin |
|
660-29ABT4EHEATSINK EXTRUSION 37MM |
4,479 |
|
Datasheet |
660 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.530" (38.86mm) | 1.530" (38.86mm) | - | 0.285" (7.24mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 7.00°C/W @ 100 LFM | - | Aluminum | Black Anodized |
|
ATS-P1-165-C2-R0HEATSINK 25X25X10MM R-TAB T766 |
3,637 |
|
Datasheet |
pushPIN™ | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | 0.394" (10.00mm) | Push Pin | - | 18.36°C/W @ 100 LFM | - | Aluminum | Blue Anodized |
|
DA-T268-401E-TRTO-268 SMD HEAT SINK ANODZD |
2,750 |
|
Datasheet |
D | Tape & Reel (TR) | Active | Top Mount | TO-268 (D³Pak) | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | 0.460" (11.68mm) | Solderable Feet | 9.0W @ 43°C | 5°C/W @ 500 LFM | - | Aluminum | Black Anodized |
|
547-95ABHEATSINK DC/DC QUARTER BRICK |
3,841 |
|
Datasheet |
547 | Bulk | Active | Board Level, Vertical | Quarter Brick DC/DC Converter | Rectangular, Fins | 1.450" (36.83mm) | 2.280" (57.91mm) | - | 0.950" (24.13mm) | Bolt On, Thermal Material | - | 2.20°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
662-15ABT3HEATSINK EXTRUSION 45MM |
2,955 |
|
Datasheet |
662 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.713" (43.51mm) | 1.713" (43.51mm) | - | 0.150" (3.81mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 8.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
326005R00000GBOARD LEVEL HEAT SINK |
4,252 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-5 | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | 0.375" (9.52mm) | Press Fit | 1.8W @ 90°C | 30.00°C/W @ 200 LFM | 57.00°C/W | Aluminum | Red Anodized |
|
659-65ABT4EHEATSINK EXTRUSION 37MM |
4,392 |
|
Datasheet |
659 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.450" (36.83mm) | 1.450" (36.83mm) | - | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 20°C | 1.50°C/W @ 600 LFM | - | Aluminum | Black Anodized |
|
591202B03100GBOARD LEVEL HEAT SINK |
4,203 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-220, TO-262 | Rectangular, Fins | 0.600" (15.24mm) | 0.500" (12.70mm) | - | 0.500" (12.70mm) | Clip and PC Pin | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | Aluminum | Black Anodized |
|
660-29ABT5HEATSINK EXTRUSION 37MM |
2,840 |
|
Datasheet |
660 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.530" (38.86mm) | 1.530" (38.86mm) | - | 0.285" (7.24mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 7.00°C/W @ 100 LFM | - | Aluminum | Black Anodized |
|
501906B00000GBOARD LEVEL HEAT SINK |
2,594 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-66 | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | - | 1.000" (25.40mm) | Bolt On | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 8.00°C/W | Aluminum | Black Anodized |
|
374124B00032GBGA,374124B00032G |
2,450 |
|
- |
- | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | - | 0.709" (18.00mm) | Thermal Tape, Adhesive (Included) | - | 7.39°C/W @ 200 LFM | 23.40°C/W | Aluminum | Black Anodized |
|
662-15AGT3HEATSINK EXTRUSION 45MM |
2,469 |
|
Datasheet |
662 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.713" (43.51mm) | 1.713" (43.51mm) | - | 0.150" (3.81mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 8.00°C/W @ 200 LFM | - | Aluminum | Gold Iridite |
|
662-15AGT5HEATSINK EXTRUSION 45MM |
2,996 |
|
Datasheet |
662 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.713" (43.51mm) | 1.713" (43.51mm) | - | 0.150" (3.81mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 8.00°C/W @ 200 LFM | - | Aluminum | Gold Iridite |
|
|
BDN17-3CB/A01HEATSINK CPU W/ADHESIVE 1.71"SQ |
2,572 |
|
Datasheet |
BDN | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Pin Fins | 1.710" (43.43mm) | 1.710" (43.43mm) | - | 0.355" (9.02mm) | Thermal Tape, Adhesive (Included) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | Aluminum | Black Anodized |
|
0372505020CHIPSET COOLER #2 COPPER 6500RPM |
4,874 |
|
- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - |