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    Heat Sinks

    制造商 Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Package Cooled Shape Length Width Diameter Fin Height Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    577304B00000G

    577304B00000G

    HEATSINK TO-202 LOW PROFILE.375"

    Boyd Laconia, LLC

    14
    RFQ
    577304B00000G

    Datasheet

    - Bag Active Board Level TO-202 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) Bolt On 1.0W @ 30°C 8.00°C/W @ 500 LFM 27.20°C/W Aluminum Black Anodized
    V5220L

    V5220L

    HEATSINK ALUM ANOD TO-220

    Assmann WSW Components

    4,199
    RFQ
    V5220L

    Datasheet

    - Bulk Active Board Level TO-220 Rectangular, Fins 1.181" (30.00mm) 1.260" (32.00mm) - 0.787" (19.99mm) Bolt On - - 8.00°C/W Aluminum Black Anodized
    PRT-18704

    PRT-18704

    HEATSINK - 13.20 X 12.10 MM (COP

    SparkFun Electronics

    23
    RFQ

    -

    - Box Active Top Mount - Rectangular, Fins 0.520" (13.20mm) 0.476" (12.10mm) - - Thermal Tape - - - Copper -
    658-25ABT4E

    658-25ABT4E

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    4,732
    RFQ
    658-25ABT4E

    Datasheet

    658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) Adhesive 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
    374324B00035G

    374324B00035G

    HEATSINK BGA W/ADHESIVE TAPE

    Boyd Laconia, LLC

    3,063
    RFQ
    374324B00035G

    Datasheet

    37432 Box Active Board Level BGA, FPGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) 3.0W @ 90°C 9.30°C/W @ 200 LFM 30.60°C/W Aluminum Black Anodized
    AATS014014010-SF-3I

    AATS014014010-SF-3I

    HEATSINK 14X14X10MM

    Advanced Thermal Solutions Inc.

    3
    RFQ

    -

    - Bulk Active Top Mount BGA Square, Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) - 19.32°C/W @ 200 LFM - Aluminum Black Anodized
    658-45ABT4E

    658-45ABT4E

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    2,118
    RFQ
    658-45ABT4E

    Datasheet

    658 Bulk Active Top Mount BGA Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.450" (11.43mm) Thermal Tape, Adhesive (Included) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum Black Anodized
    219-263A

    219-263A

    TO-263 HEAT SINK ANODZD

    Wakefield-Vette

    2,406
    RFQ
    219-263A

    Datasheet

    219 Bulk Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.480" (12.19mm) Solderable Feet 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Black Anodized
    DA-T268-101E-TR

    DA-T268-101E-TR

    TO-268 HEAT SINK /POLY TAPE

    Ohmite

    25
    RFQ
    DA-T268-101E-TR

    Datasheet

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.400" (10.16mm) Solderable Feet 5.0W @ 35°C 6.00°C/W @ 600 LFM - Aluminum Black Anodized
    V2032B

    V2032B

    HEATSINK CPU FORGED

    Assmann WSW Components

    3,675
    RFQ
    V2032B

    Datasheet

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.728" (18.50mm) Thermal Tape, Adhesive (Not Included) - - 5.00°C/W Aluminum Alloy Black Anodized
    XL25D-TO247-22-17-0.64

    XL25D-TO247-22-17-0.64

    CERAMIC HEAT SPREADER 22X17X0.63

    t-Global Technology

    4
    RFQ
    XL25D-TO247-22-17-0.64

    Datasheet

    XL-25 Bulk Active Heat Spreader TO-247 Rectangular 0.866" (22.00mm) 0.669" (17.00mm) - 0.025" (0.64mm) Thermal Tape - - - Ceramic -
    HSB37-404023

    HSB37-404023

    HEAT SINK, BGA, 40 X 40 X 23 MM

    Same Sky (Formerly CUI Devices)

    3,156
    RFQ
    HSB37-404023

    Datasheet

    HSB Box Active Top Mount BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.905" (23.00mm) Adhesive (Not Included) 11.7W @ 75°C 2.10°C/W @ 200 LFM 6.43°C/W Aluminum Alloy Black Anodized
    547-45AB

    547-45AB

    HEATSINK DC/DC QUARTER BRICK

    Wakefield-Vette

    2,754
    RFQ
    547-45AB

    Datasheet

    547 Bulk Active Board Level, Vertical Quarter Brick DC/DC Converter Rectangular, Fins 1.450" (36.83mm) 2.280" (57.91mm) - 0.450" (11.43mm) Bolt On, Thermal Material - 2.10°C/W @ 300 LFM - Aluminum Black Anodized
    374624B00032G

    374624B00032G

    HEATSINK BGA 35X35X10MM W/ADH

    Boyd Laconia, LLC

    2,305
    RFQ
    374624B00032G

    Datasheet

    - Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) 1.5W @ 40°C 7.60°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
    E2A-T247-38E

    E2A-T247-38E

    BLACK ANODIZED HEATSINK

    Ohmite

    4,264
    RFQ
    E2A-T247-38E

    Datasheet

    EX Box Active Board Level, Vertical TO-247 Rectangular, Fins 0.641" (16.28mm) 0.642" (16.30mm) - 1.500" (38.10mm) Bolt On and Board Mounts 4.0W @ 70°C 4.00°C/W @ 300 LFM 14.00°C/W Aluminum Black Anodized
    375024B00032G

    375024B00032G

    HEATSINK BGA W/ADHESIVE TAPE

    Boyd Laconia, LLC

    3,401
    RFQ
    375024B00032G

    Datasheet

    - Bulk Active Top Mount BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.01mm) - 0.709" (18.00mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 4.30°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
    WAVE-23-165

    WAVE-23-165

    ANCHOR HEATSINK 23X23X16.5MM

    Wakefield-Vette

    2,215
    RFQ
    WAVE-23-165

    Datasheet

    Wave 2x Bulk Active Board Level BGA Square, Angled Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.650" (16.51mm) Clip - 5.08°C/W @ 200 LFM - Aluminum Alloy Black Anodized
    ATS-CPX030030010-141-C2-R0

    ATS-CPX030030010-141-C2-R0

    HEATSINK 30X30X10MM L-TAB CP

    Advanced Thermal Solutions Inc.

    100
    RFQ
    ATS-CPX030030010-141-C2-R0

    Datasheet

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.394" (10.00mm) Push Pin - 15.71°C/W @ 100 LFM - Aluminum Blue Anodized
    XL25D-TO247-22-17-1

    XL25D-TO247-22-17-1

    CERAMIC HEAT SPREADER 22X17X1MM

    t-Global Technology

    10
    RFQ
    XL25D-TO247-22-17-1

    Datasheet

    XL-25 Bulk Active Heat Spreader TO-247 Rectangular 0.866" (22.00mm) 0.669" (17.00mm) - 0.039" (1.00mm) Thermal Tape - - - Ceramic -
    567-94AB

    567-94AB

    1/8 BRICK HEATSINK 57.9X55X23.9M

    Wakefield-Vette

    4,876
    RFQ
    567-94AB

    Datasheet

    567 Bulk Active Top Mount Eighth Brick DC/DC Converter Rectangular, Fins 2.280" (57.90mm) 2.165" (55.00mm) - 0.940" (23.88mm) Bolt On, Thermal Material - 2.20°C/W @ 300 LFM 2.20°C/W - Unfinished
    Total 122183 Record«Prev1... 580581582583584585586587...6110Next»
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