| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Package Cooled | Shape | Length | Width | Diameter | Fin Height | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
577304B00000GHEATSINK TO-202 LOW PROFILE.375" |
14 |
|
Datasheet |
- | Bag | Active | Board Level | TO-202 | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | 0.375" (9.52mm) | Bolt On | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 27.20°C/W | Aluminum | Black Anodized |
|
|
V5220LHEATSINK ALUM ANOD TO-220 |
4,199 |
|
Datasheet |
- | Bulk | Active | Board Level | TO-220 | Rectangular, Fins | 1.181" (30.00mm) | 1.260" (32.00mm) | - | 0.787" (19.99mm) | Bolt On | - | - | 8.00°C/W | Aluminum | Black Anodized |
|
PRT-18704HEATSINK - 13.20 X 12.10 MM (COP |
23 |
|
- |
- | Box | Active | Top Mount | - | Rectangular, Fins | 0.520" (13.20mm) | 0.476" (12.10mm) | - | - | Thermal Tape | - | - | - | Copper | - |
|
|
658-25ABT4EHEATSINK CPU 28MM SQ BLK W/TAPE |
4,732 |
|
Datasheet |
658 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | 0.250" (6.35mm) | Adhesive | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Aluminum | Black Anodized |
|
374324B00035GHEATSINK BGA W/ADHESIVE TAPE |
3,063 |
|
Datasheet |
37432 | Box | Active | Board Level | BGA, FPGA | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.394" (10.00mm) | Thermal Tape, Adhesive (Included) | 3.0W @ 90°C | 9.30°C/W @ 200 LFM | 30.60°C/W | Aluminum | Black Anodized |
|
AATS014014010-SF-3IHEATSINK 14X14X10MM |
3 |
|
- |
- | Bulk | Active | Top Mount | BGA | Square, Fins | 0.551" (14.00mm) | 0.551" (14.00mm) | - | 0.394" (10.00mm) | Thermal Tape, Adhesive (Included) | - | 19.32°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
|
658-45ABT4EHEATSINK CPU 28MM SQ BLK W/TAPE |
2,118 |
|
Datasheet |
658 | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | 0.450" (11.43mm) | Thermal Tape, Adhesive (Included) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
219-263ATO-263 HEAT SINK ANODZD |
2,406 |
|
Datasheet |
219 | Bulk | Active | Top Mount | TO-263 (D²Pak) | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | 0.480" (12.19mm) | Solderable Feet | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | Black Anodized |
|
DA-T268-101E-TRTO-268 HEAT SINK /POLY TAPE |
25 |
|
Datasheet |
D | Tape & Reel (TR) | Active | Top Mount | TO-268 (D³Pak) | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | 0.400" (10.16mm) | Solderable Feet | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Aluminum | Black Anodized |
|
V2032BHEATSINK CPU FORGED |
3,675 |
|
Datasheet |
- | Bulk | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | 0.728" (18.50mm) | Thermal Tape, Adhesive (Not Included) | - | - | 5.00°C/W | Aluminum Alloy | Black Anodized |
|
XL25D-TO247-22-17-0.64CERAMIC HEAT SPREADER 22X17X0.63 |
4 |
|
Datasheet |
XL-25 | Bulk | Active | Heat Spreader | TO-247 | Rectangular | 0.866" (22.00mm) | 0.669" (17.00mm) | - | 0.025" (0.64mm) | Thermal Tape | - | - | - | Ceramic | - |
|
HSB37-404023HEAT SINK, BGA, 40 X 40 X 23 MM |
3,156 |
|
Datasheet |
HSB | Box | Active | Top Mount | BGA | Square, Pin Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.905" (23.00mm) | Adhesive (Not Included) | 11.7W @ 75°C | 2.10°C/W @ 200 LFM | 6.43°C/W | Aluminum Alloy | Black Anodized |
|
547-45ABHEATSINK DC/DC QUARTER BRICK |
2,754 |
|
Datasheet |
547 | Bulk | Active | Board Level, Vertical | Quarter Brick DC/DC Converter | Rectangular, Fins | 1.450" (36.83mm) | 2.280" (57.91mm) | - | 0.450" (11.43mm) | Bolt On, Thermal Material | - | 2.10°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
374624B00032GHEATSINK BGA 35X35X10MM W/ADH |
2,305 |
|
Datasheet |
- | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | 0.394" (10.00mm) | Thermal Tape, Adhesive (Included) | 1.5W @ 40°C | 7.60°C/W @ 200 LFM | 23.40°C/W | Aluminum | Black Anodized |
|
|
E2A-T247-38EBLACK ANODIZED HEATSINK |
4,264 |
|
Datasheet |
EX | Box | Active | Board Level, Vertical | TO-247 | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | 1.500" (38.10mm) | Bolt On and Board Mounts | 4.0W @ 70°C | 4.00°C/W @ 300 LFM | 14.00°C/W | Aluminum | Black Anodized |
|
375024B00032GHEATSINK BGA W/ADHESIVE TAPE |
3,401 |
|
Datasheet |
- | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.575" (40.00mm) | 1.575" (40.01mm) | - | 0.709" (18.00mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 4.30°C/W @ 200 LFM | 12.00°C/W | Aluminum | Black Anodized |
|
WAVE-23-165ANCHOR HEATSINK 23X23X16.5MM |
2,215 |
|
Datasheet |
Wave 2x | Bulk | Active | Board Level | BGA | Square, Angled Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | - | 0.650" (16.51mm) | Clip | - | 5.08°C/W @ 200 LFM | - | Aluminum Alloy | Black Anodized |
|
|
ATS-CPX030030010-141-C2-R0HEATSINK 30X30X10MM L-TAB CP |
100 |
|
Datasheet |
pushPIN™ | Bulk | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | 0.394" (10.00mm) | Push Pin | - | 15.71°C/W @ 100 LFM | - | Aluminum | Blue Anodized |
|
XL25D-TO247-22-17-1CERAMIC HEAT SPREADER 22X17X1MM |
10 |
|
Datasheet |
XL-25 | Bulk | Active | Heat Spreader | TO-247 | Rectangular | 0.866" (22.00mm) | 0.669" (17.00mm) | - | 0.039" (1.00mm) | Thermal Tape | - | - | - | Ceramic | - |
|
567-94AB1/8 BRICK HEATSINK 57.9X55X23.9M |
4,876 |
|
Datasheet |
567 | Bulk | Active | Top Mount | Eighth Brick DC/DC Converter | Rectangular, Fins | 2.280" (57.90mm) | 2.165" (55.00mm) | - | 0.940" (23.88mm) | Bolt On, Thermal Material | - | 2.20°C/W @ 300 LFM | 2.20°C/W | - | Unfinished |