MT29F2G01ABAGDWB-IT:G --2Gb SLC SPI NAND Flash

Introduction

MT29F2G01ABAGDWB-IT:G is a 2Gbit NAND Flash memory that supports SPI interface. It has an 8-pin U-PDFN package with low pin count, making it suitable for space-constrained embedded or industrial systems. It is suitable for applications in embedded systems, industrial equipment, and scenarios requiring high reliability and durability storage.

Datasheet keys

1. Storage density: 2 Gbit (2 G × 1)
2. Interface type: SPI (standard/extended SPI)
3. Maximum clock frequency: ≈ 133 MHz
4. Voltage range (VCC): 2.7 V - 3.6 V
5. Package: 8-pin U-PDFN
6. Temperature range: -40 °C to +85 °C (industrial grade)
7. Durability: 100,000 program/erase cycles (typical)
8. Data retention period (unwritten): 10 years (at 85 °C)

Features

• Single-level cell (SLC) technology
• 2Gb density
• Organization
• Page size x1: 2176 bytes (2048 + 128 bytes)
• Block size: 64 pages (128K + 8K bytes)
• Plane size: 2Gb (2 planes, 1024 blocks per plane)
• Standard and extended SPI-compatible serial businterface
• Instruction, address on 1 pin; data out on 1, 2, or4 pins
• Instruction on 1 pin; address, data out on 2 or 4pins
• Instruction, address on 1 pin; data in on 1 or 4pins
• User-selectable internal ECC supported– 8 bits/sector
• Array performance
• 133 MHz clock frequency (MAX)
• Page read: 25µs (MAX) with on-die ECC disabled;70µs (MAX) with on-die ECC enabled
• Page program: 200µs (TYP) with on-die ECC disabled; 220µs (TYP) with on-die ECC enabled
• Block erase: 2ms (TYP)
• Advanced features
• Read page cache mode
• Read unique ID
• Read parameter page
• Device initialization
• Automatic device initialization after power-up
• Security
• Blocks 7:0 are valid when shipped from factorywith ECC enabled
• Software write protection with lock register
• Hardware write protection to freeze BP bits
• Lock tight to freeze BP bits during one power cycle
• Permanent block lock protection
• OTP Space: 10 pages one-time programmableNAND Flash memory area
• Operating voltage range
• VCC = 2.7–3.6V
• Operating temperature
• Industrial: –40°C to +85°C
• Quality and reliability
• Endurance: 100,000 PROGRAM/ERASE cycles
• Data retention: JESD47H-compliant; see qualification report
• Additional: Uncycled data retention: 10 years24/7 @85°C
• Package
• 16-pin SOP, 300 mils (package code: SF)
• 8-pin U-PDFN, 8mm x 6mm x 0.65mm (MLP8)(package code: WB)
• 24-ball T-PBGA, 05/6mm x 8mm (5 x 5 array)(package code: 12)

Packaging, Pins

• Packaging: U-PDFN-8 (6 × 8 mm) surface mount
• Note: ESD protection, re-etch sensitivity (MSL)
• Attention to signal integrity and layout of power/ground planes during wiring.
• The bottom of the package needs a heat dissipation or grounding pad to ensure complete thermal management and grounding.

Working Principle

1. Storage Array Structure

• Page = 2048B data + 128B OOB
• Block = 64 Pages Plane = 1024 Blocks
• Full chip 2Gb = 2 Planes

2. SPI Data Access

Read process: Page → Data Register

Data Register → SPI Output

Writing Process:

Write data to the internal Data Register (SPI)

Program Execution: Write the data in the register to the Page

Erase Process:

Issue the BLOCK ERASE command

The Flash will restore all bits of the entire Block to "1"

3. Built-in ECC

• Correct bit errors caused by storage aging
• Improve data reliability
• Extend system lifespan

4. Security and Protection

• Software locks the register
• The hardware WP# pin can freeze the BP bit
• Lock Tight: Completely lock within one power-on cycle

• Fixed 10 pages
• Cannot be modified after program writing
• Suitable for writing serial numbers, check codes, etc.

5. Power-on Initialization

• Execute the internal initialization sequence
• Read the parameter page
• Reload the ECC table
• Enter the standby accessible state

Design Considerations

1. For use in MCU/Embedded Systems, it is necessary to confirm that the MCU/controller supports the command set of this SPI NAND.
2. NAND has block-level management requirements, so the software needs to have Bad Block Management, wear-leveling, and block locking mechanisms.
3. For high-reliability requirements (such as industrial, automotive-grade), it is recommended to consider temperature-induced degradation, data retention capability, and the manufacturer's reliability certification report.
4. When purchasing, it is necessary to confirm that the complete part number suffix (such as "IT:G") corresponds to the function, version, and package with the design. 

Conclusion