


With the rapid development of IoT, industrial control, smart terminals, and in-vehicle electronic devices, systems have placed higher demands on memory: not only do they require faster data reading speeds, but also lower power consumption, smaller packaging, and higher security. Under such market demands, Winbond's W25R256JWEIQ has become a popular choice in the low-power SPI NOR Flash field.
The W25R256JWEIQ adopts a small-sized WSON-8 package, which is highly suitable for high-density PCB designs.
Its advantages include:
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| Part Number | W25R256JWEIQ TR | W25R256JWEIQ |
| Manufacturer | Winbond Electronics | Winbond Electronics Corporation |
| Series | - | - |
| Package/Case | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad |
| Packaging | Tape & Reel (TR) | Tray |
| Part Status | Active | Active |
| Programmable | Not Verified | Not Verified |
| Memory Type | Non-Volatile | Non-Volatile |
| Technology | FLASH - NOR | FLASH - NOR |
| Memory Size | 256Mbit | 256Mbit |
| Memory Organization | 32M x 8 | 32M x 8 |
| Supplier Device Package | 8-WSON (8x6) | 8-WSON (8x6) |
| Memory Interface | SPI | SPI |
| Clock Frequency | 104 MHz | 104 MHz |
| Memory Format | FLASH | FLASH |
| Write Cycle Time - Word, Page | - | - |
| Access Time | - | - |
| Mounting Style | Surface Mount | Surface Mount |
| Voltage - Supply | 1.7V ~ 1.95V | 1.7V ~ 1.95V |
| Qualification | - | - |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C |
| Grade | - | - |

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Microchip Technology

Microchip Technology

Microchip Technology

Microchip Technology
STMicroelectronics