Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
0 |
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![]() Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC35FS4503NAER2FS4500 NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS8435G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
0 |
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![]() Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8435G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
0 |
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![]() Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC35FS6512NAEFS6500 NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS4507CAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 NXP USA Inc. |
0 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 NXP USA Inc. |
0 |
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- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |