| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,140 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,127 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,213 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
4,685 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,784 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,867 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,981 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,307 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,590 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,027 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |