| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33FS6520CAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6515LAESYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6505LAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
TEA2209T/1JIC ACTIVE BRIDGE CTRL SO16 NXP USA Inc. |
2,315 |
|
Datasheet |
- | 16-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Active | Desktop, Notebook PCs | 2mA | -40°C ~ 125°C (TJ) | - | - | Surface Mount | 16-SO | 440V |
|
|
MFS8600BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 60V |
|
MC33FS6515CAESYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6520LAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MFS2621AMDABADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MPF7100BMBA0ESPF7100 PMIC OTP NXP USA Inc. |
256 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 2.5V ~ 5.5V |
|
MC35FS6505CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |