| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33FS6527NAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6525LAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6503NAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
120 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
|
MFS8633BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 36V |
|
|
MFS8610BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 60V |
|
MFS2613AMDA2ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
118 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MPF7100BVMA3ESPF7100 PMIC I.MX8DXP/DX NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 2.5V ~ 5.5V |
|
|
MFS8600BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
260 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 60V |
|
MC33FS6523NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS4508NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
250 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |