| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS2301BMBA0EPMFS2301BMBA0EP NXP USA Inc. |
2,484 |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC34912BACIC SYSTEM BASIS CHIP LIN 32-LQFP NXP USA Inc. |
4,516 |
|
Datasheet |
- | 32-LQFP | Tray | Active | System Basis Chip | 4.5mA | -40°C ~ 85°C | - | - | Surface Mount | 32-LQFP (7x7) | 5.5V ~ 18V |
|
MFS2321BMBA0EPR2MFS2321BMBA0EPR2 NXP USA Inc. |
3,941 |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2321BMBB2EPR2MFS2321BMBB2EPR2 NXP USA Inc. |
4,159 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 5.5V ~ 40V |
|
MFS2302BMBA0EPR2MFS2302BMBA0EPR2 NXP USA Inc. |
3,970 |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2322BMMA0EPR2MFS2322BMMA0EPR2 NXP USA Inc. |
3,962 |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2321BMMA0EPMFS2321BMMA0EP NXP USA Inc. |
4,625 |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MFS2302BMMA0EPMFS2302BMMA0EP NXP USA Inc. |
4,518 |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MFS2324BMBA0EPMFS2324BMBA0EP NXP USA Inc. |
3,716 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | -40°C ~ 120°C | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 3.3V, 5V |
|
MC34PF3001A6EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
2,589 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) | 2.8V ~ 5.5V |