| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS8620BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
2,931 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 36V |
|
MPF5020CVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,026 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | - | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | - |
|
MPF5020CMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,840 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | - | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | - |
|
MPF5020AVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,122 |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 10µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
MPF5020CMMACESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,090 |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MPF5020AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,087 |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Microcontroller, MCU | 40µA | -40°C ~ 150°C (TJ) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.7V ~ 5.5V |
|
PCA9452AHNKPCA9452AHNK NXP USA Inc. |
3,080 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Bulk | Active | Processor | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | 56-HVQFN-EP (8x8) | - |
|
MPF5023AVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,507 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
MPF5023CMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,411 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
MPF5023AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
4,536 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |