Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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MPF5030BMMA4ESR2PMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
0 |
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![]() Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5030BMMA0ESR2PMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
0 |
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![]() Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MFS8620BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33FS6500NAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MPF5032BMDA0ESR2PMIC 2 BUCKS 2 LDO NXP USA Inc. |
0 |
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![]() Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MC33FS6505KAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MWSP10C1AVLCAUTOQI WIRELESS CHARGING NXP USA Inc. |
0 |
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- |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
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MPF5024CMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
0 |
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![]() Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5024CVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
0 |
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![]() Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5030BMBA0ESR2PMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |