| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC34PF3001A2EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
3,349 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) | 2.8V ~ 5.5V |
|
MC34PF3001A4EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
4,207 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) | 2.8V ~ 5.5V |
|
MC34PF3001A5EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
2,989 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) | 2.8V ~ 5.5V |
|
MFS2323BMBA0EPMFS2323BMBA0EP NXP USA Inc. |
3,327 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | - | - | - | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | - |
|
MFS2323BMBA1EPMFS2323BMBA1EP NXP USA Inc. |
2,664 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | - | - | - | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | - |
|
|
MFS8630BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
4,343 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 36V |
|
MFS8600BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
2,721 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 60V |
|
MFS2600AMBA0ADR2AUTO SBC NXP USA Inc. |
4,577 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 30µA | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MPF5030BMDA0ESR2POWER MANAGEMENT IC, S32, NON-PR NXP USA Inc. |
4,222 |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 3.3V ~ 5.25V |
|
MC33FS6510NAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
4,724 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |