| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33FS4505LAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
3,203 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MPF5024CMBA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
2,571 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
MPF5024AMBA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
3,119 |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 10µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) | 2.5V ~ 5.5V |
|
|
MFS8623BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,884 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 36V |
|
MFS8622BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
3,062 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 36V |
|
MCZ33099EGIC VREG ALTERNATOR ADAPT 16-SOIC NXP USA Inc. |
3,103 |
|
Datasheet |
- | 16-SOIC (0.295", 7.50mm Width) | Tube | Obsolete | - | 6.5mA | -40°C ~ 125°C | Automotive | - | Surface Mount | 16-SOIC | 7V ~ 18V |
|
MC33FS8400G5ESR2SYSTEM BASIS CHIP FS8400 NXP USA Inc. |
4,401 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MC33FS6500CAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
2,702 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC34710EWR2IC PWR SUPPLY ADJ DUAL SW 32SOIC NXP USA Inc. |
2,851 |
|
Datasheet |
- | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Tape & Reel (TR) | Obsolete | General Purpose, Supervisor, Sequence | 7.5mA | 0°C ~ 85°C | - | - | Surface Mount | 32-SOIC-EP | 13V ~ 32V |
|
MC33FS6525KAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
4,150 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |