Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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4912PA51H00100RFI FOF GASKET PU ADH Laird Technologies EMI |
0 |
|
- |
51H | Bulk | Active | Fabric Over Foam | D-Shape | 0.150" (3.81mm) | 1.000" (25.40mm) | 0.090" (2.29mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 70°C |
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67BCG2504303510R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
0 |
|
![]() Datasheet |
BCG | Bulk | Active | Fingerstock | - | 0.098" (2.50mm) | 0.169" (4.30mm) | 0.138" (3.50mm) | Beryllium Copper | Gold | - | Solder | - |
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4157PA51H00100RFI FOF GASKET PU ADH Laird Technologies EMI |
0 |
|
- |
ECOGREEN™ | Bulk | Active | Fabric Over Foam | Rectangle | 0.787" (20.00mm) | 1.000" (25.40mm) | 0.630" (16.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 70°C |
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67BCG2003201508R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
0 |
|
![]() Datasheet |
BCG | Bulk | Active | Fingerstock | - | 0.078" (2.00mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Beryllium Copper | Gold | - | Solder | - |
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67B5N4004005108R00SP,CON,TNR 5.10X4.00X4.00MM Laird Technologies EMI |
0 |
|
- |
- | Cut Tape (CT) | Active | - | - | - | - | - | - | - | - | - | - |
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4788PB51H00100RFI FOF GASKET PU ADH Laird Technologies EMI |
0 |
|
![]() Datasheet |
ECOGREEN™ | Bulk | Active | Fabric Over Foam | Rectangle | 0.250" (6.35mm) | 1.000" (25.40mm) | 0.125" (3.18mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 70°C |
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67SLG040040025PI00RFI FILM OVER FOAM PU SOLDER Laird Technologies EMI |
0 |
|
![]() Datasheet |
SMD Grounding Metallized | Tape & Reel (TR) | Active | Film Over Foam | Rectangle | 0.157" (4.00mm) | 0.098" (2.50mm) | 0.157" (4.00mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder | -40°C ~ 70°C |
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4084AA51K00100RFI FOF GASKET PU Laird Technologies EMI |
0 |
|
![]() Datasheet |
51K | Bulk | Active | Fabric Over Foam | Square | 0.500" (12.70mm) | 1.000" (25.40mm) | 0.500" (12.70mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
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4692PA51G00200RFI FOF GASKET ADH Laird Technologies EMI |
0 |
|
![]() Datasheet |
51G | Bulk | Active | Fabric Over Foam | D-Shape | 0.252" (6.40mm) | 2.000" (50.80mm) | 0.142" (3.60mm) | - | - | - | Adhesive | - |
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67B7G2504005010R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
0 |
|
![]() Datasheet |
- | Bulk | Active | Fingerstock | - | 0.098" (2.50mm) | 0.157" (4.00mm) | 0.197" (5.00mm) | Beryllium Copper | Gold | - | Solder | - |