Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
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0077001619RFI FINGERSTOCK BECU NICKEL SLOT Laird Technologies EMI |
0 |
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- |
77 | Bulk | Active | Fingerstock | - | 0.320" (8.13mm) | 0.169" (4.29mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Slot | 121°C |
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0077001519RFI FINGERSTOCK BECU NICKEL SLOT Laird Technologies EMI |
0 |
|
- |
77 | Bulk | Active | Fingerstock | - | 0.600" (15.24mm) | 0.250" (6.35mm) | 0.220" (5.59mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Slot | 121°C |
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0077003917RFI FINGERSTOCK BECU TIN SLOT Laird Technologies EMI |
0 |
|
- |
77 | Bulk | Active | Fingerstock | - | 0.787" (20.00mm) | 0.169" (4.29mm) | 0.110" (2.79mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot | 121°C |
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67BXG2503504008R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
0 |
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![]() Datasheet |
BXG | Bulk | Active | Fingerstock | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.157" (4.00mm) | Beryllium Copper | Gold | - | Solder | - |
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0077004402RFI FINGERSTOCK BECU NICKEL SLOT Laird Technologies EMI |
0 |
|
![]() Datasheet |
Slot Mount | Box | Active | Fingerstock | - | 0.320" (8.13mm) | 1.104" (28.04mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Slot | 121°C |
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0077005502RFI FINGERSTOCK BECU SLOT Laird Technologies EMI |
0 |
|
![]() Datasheet |
Slot Mount | Box | Active | Fingerstock | - | 0.320" (8.13mm) | 1.852" (47.04mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Slot | 121°C |
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67B8G2507006215R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
0 |
|
![]() Datasheet |
- | Bulk | Active | Fingerstock | - | 0.098" (2.50mm) | 0.276" (7.00mm) | 0.244" (6.20mm) | Beryllium Copper | Gold | - | Solder | - |
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67SLG040035030PI00RFI FILM OVER FOAM PU SOLDER Laird Technologies EMI |
0 |
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![]() Datasheet |
SMD Grounding Metallized | Tape & Reel (TR) | Active | Film Over Foam | Rectangle | 0.157" (4.00mm) | 0.118" (3.00mm) | 0.138" (3.50mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder | -40°C ~ 70°C |
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67B3G2003805508R00RFI SHLD FINGER BECU NICKEL Laird Technologies EMI |
0 |
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![]() Datasheet |
B3G | Tape & Reel (TR) | Active | Shield Finger | - | 0.079" (2.00mm) | 0.150" (3.80mm) | 0.217" (5.50mm) | Beryllium Copper | Nickel | - | - | - |
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0D97098319RFI FINGERSTOCK BECU NICKEL CLIP Laird Technologies EMI |
0 |
|
- |
Card Guide Clip-On | Bulk | Active | Fingerstock | - | 0.080" (2.03mm) | 0.375" (9.52mm) | 0.062" (1.57mm) | Beryllium Copper | Nickel | 299.99µin (7.62µm) | Clip | - |