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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    06-1518-10H

    06-1518-10H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 2,100
    RFQ
    		06-1518-10H

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0517-90C

    02-0517-90C

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    		 3,513
    RFQ
    		02-0517-90C

    Datasheet

         		0517 Bulk Active SIP 2 (1 x 2) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0102-T-10

    HLS-0102-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,260
    RFQ
    		HLS-0102-T-10

    Datasheet

         		HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    DIP624-011B

    DIP624-011B

    DIP624-011B-DIP SOCKET 24 CTS

    Amphenol ICC (FCI)

    		 3,764
    RFQ
    		DIP624-011B

    Datasheet

         		- Bag Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    130-028-000

    130-028-000

    CONN IC DIP SOCKET 28POS GOLD

    3M

    		 4,038
    RFQ

    -

    		 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    110-87-310-41-105161

    110-87-310-41-105161

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 3,896
    RFQ
    		110-87-310-41-105161

    Datasheet

         		110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AJ 42-LC

    AJ 42-LC

    SOCKET

    Assmann WSW Components

    		 2,368
    RFQ

    -

    		 - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    116-87-310-41-006101

    116-87-310-41-006101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 4,154
    RFQ
    		116-87-310-41-006101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-306-41-134191

    114-83-306-41-134191

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    		 2,665
    RFQ
    		114-83-306-41-134191

    Datasheet

         		114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    WMS-2810Z

    WMS-2810Z

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    		 4,865
    RFQ
    		WMS-2810Z

    Datasheet

         		WMS Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    AR 10-HZL/07-TT

    AR 10-HZL/07-TT

    IC SOCKET 10 PIN MACH CONT

    Assmann WSW Components

    		 2,327
    RFQ
    		AR 10-HZL/07-TT

    Datasheet

         		- Tube Active - - - - - - - - - - - - - - -
    A-CCS32-G

    A-CCS32-G

    CONN SOCKET PLCC 32POS GOLD

    Assmann WSW Components

    		 4,042
    RFQ
    		A-CCS32-G

    Datasheet

         		- Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    612-87-610-41-001101

    612-87-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 2,227
    RFQ
    		612-87-610-41-001101

    Datasheet

         		612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0518-11

    05-0518-11

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    		 3,010
    RFQ
    		05-0518-11

    Datasheet

         		518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AW 127-37/Z-T

    AW 127-37/Z-T

    SOCKET 37 CONTACTS SINGLE ROW

    Assmann WSW Components

    		 3,371
    RFQ
    		AW 127-37/Z-T

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    A-CCS52-Z-SM-R

    A-CCS52-Z-SM-R

    CONN SOCKET PLCC 52POS TIN

    Assmann WSW Components

    		 2,822
    RFQ
    		A-CCS52-Z-SM-R

    Datasheet

         		- Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    116-87-308-41-012101

    116-87-308-41-012101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 5,000
    RFQ
    		116-87-308-41-012101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HGL/7-TT

    AR 22-HGL/7-TT

    SOCKET

    Assmann WSW Components

    		 2,532
    RFQ

    -

    		 AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Brass Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    HLS-0102-T-11

    HLS-0102-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,662
    RFQ
    		HLS-0102-T-11

    Datasheet

         		HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-83-012-05-001101

    510-83-012-05-001101

    CONN SOCKET PGA 12POS GOLD

    Preci-Dip

    		 4,713
    RFQ
    		510-83-012-05-001101

    Datasheet

         		510 Bulk Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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