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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    WMS-280Z

    WMS-280Z

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    0
    RFQ
    WMS-280Z

    Datasheet

    WMS Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    AR06-HZW/T-R

    AR06-HZW/T-R

    CONN IC DIP SOCKET 6POS TIN

    Assmann WSW Components

    0
    RFQ
    AR06-HZW/T-R

    Datasheet

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    AR 20 HGL-TT

    AR 20 HGL-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    HLS-0103-TT-12

    HLS-0103-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0103-TT-12

    Datasheet

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    110-83-210-41-001101

    110-83-210-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-210-41-001101

    Datasheet

    110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-310-41-105101

    110-87-310-41-105101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-310-41-105101

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP328-014B

    DIP328-014B

    DIP328-014B-DIP SOCKET 28 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    DIP328-014B

    Datasheet

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR28-HZL/7/07-TT

    AR28-HZL/7/07-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    0
    RFQ
    AR28-HZL/7/07-TT

    Datasheet

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    01-0503-31

    01-0503-31

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    0
    RFQ
    01-0503-31

    Datasheet

    0503 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled -
    110-87-320-41-001151

    110-87-320-41-001151

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-001101

    116-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-306-41-001101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS32-Z-SM-R

    A-CCS32-Z-SM-R

    CONN SOCKET PLCC 32POS TIN

    Assmann WSW Components

    0
    RFQ
    A-CCS32-Z-SM-R

    Datasheet

    - Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-CCS020-Z-SM/P

    A-CCS020-Z-SM/P

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    - Bulk Active PLCC 20 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    AW 127-38/Z-T

    AW 127-38/Z-T

    SOCKET 38 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-38/Z-T

    Datasheet

    - - Active - - - - - - - - - - - - - - -
    410-87-214-10-001101

    410-87-214-10-001101

    CONN ZIG-ZAG 14POS GOLD

    Preci-Dip

    0
    RFQ
    410-87-214-10-001101

    Datasheet

    410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-87-214-10-002101

    410-87-214-10-002101

    CONN ZIG-ZAG 14POS GOLD

    Preci-Dip

    0
    RFQ
    410-87-214-10-002101

    Datasheet

    410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-83-304-41-002101

    124-83-304-41-002101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ

    -

    124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-006101

    116-87-610-41-006101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-610-41-006101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1051670001

    1051670001

    SMIA65 TOP MNT CAMERA SOCKET

    Molex

    0
    RFQ
    1051670001

    Datasheet

    105167 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.037" (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder - Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
    122-83-306-41-001101

    122-83-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    122-83-306-41-001101

    Datasheet

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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