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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 20-HZL/01-TT

    AR 20-HZL/01-TT

    SOCKET

    Assmann WSW Components

    		 4,419
    RFQ

    -

    		 - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    146-83-306-41-035101

    146-83-306-41-035101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    		 4,380
    RFQ
    		146-83-306-41-035101

    Datasheet

         		146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-306-41-036101

    146-83-306-41-036101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    		 3,642
    RFQ
    		146-83-306-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1052000001

    1052000001

    SMIA55 CAMERA SOCKET BOTTOM CONT

    Molex

    		 3,069
    RFQ
    		1052000001

    Datasheet

         		105200 Tray Obsolete Camera Socket 12 (2 x 6) 0.028" (0.70mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.028" (0.70mm) Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
    410-87-216-10-001101

    410-87-216-10-001101

    CONN ZIG-ZAG 16POS GOLD

    Preci-Dip

    		 2,422
    RFQ
    		410-87-216-10-001101

    Datasheet

         		410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-87-216-10-002101

    410-87-216-10-002101

    CONN ZIG-ZAG 16POS GOLD

    Preci-Dip

    		 3,905
    RFQ
    		410-87-216-10-002101

    Datasheet

         		410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-308-41-018101

    116-83-308-41-018101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 4,258
    RFQ
    		116-83-308-41-018101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-210-41-117101

    114-83-210-41-117101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 4,572
    RFQ
    		114-83-210-41-117101

    Datasheet

         		114 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-316-01-822101

    110-83-316-01-822101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    		 2,085
    RFQ
    		110-83-316-01-822101

    Datasheet

         		110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-87-308-41-001101

    122-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 3,712
    RFQ
    		122-87-308-41-001101

    Datasheet

         		122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-312-41-006101

    116-87-312-41-006101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    		 4,303
    RFQ
    		116-87-312-41-006101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-025-05-000101

    510-87-025-05-000101

    CONN SOCKET PGA 25POS GOLD

    Preci-Dip

    		 2,377
    RFQ
    		510-87-025-05-000101

    Datasheet

         		510 Bulk Active PGA 25 (5 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-316-41-117101

    114-87-316-41-117101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    		 2,980
    RFQ
    		114-87-316-41-117101

    Datasheet

         		114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS068-Z-SM/P

    A-CCS068-Z-SM/P

    SOCKET

    Assmann WSW Components

    		 2,768
    RFQ

    -

    		 - Bulk Active PLCC 68 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    146-87-308-41-035101

    146-87-308-41-035101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 2,900
    RFQ
    		146-87-308-41-035101

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-308-41-036101

    146-87-308-41-036101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 4,198
    RFQ
    		146-87-308-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-308-41-008101

    116-87-308-41-008101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 4,286
    RFQ
    		116-87-308-41-008101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-99-020-24-000000

    540-99-020-24-000000

    CONN SOCKET PLCC 20POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    		 3,836
    RFQ
    		540-99-020-24-000000

    Datasheet

         		540 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    SIP050-1X12-157B

    SIP050-1X12-157B

    1X12-157B-SIP SOCKET 12 CTS

    Amphenol ICC (FCI)

    		 4,321
    RFQ
    		SIP050-1X12-157B

    Datasheet

         		SIP050-1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AW127-20/Z-T-R

    AW127-20/Z-T-R

    SOCKET 20 CONTACTS SINGLE ROW

    Assmann WSW Components

    		 2,097
    RFQ
    		AW127-20/Z-T-R

    Datasheet

         		- Bulk Obsolete - 20 (1 x 20) 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Brass Through Hole - Solder 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
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