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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP050-1X13-157B1X13-157B-SIP SOCKET 13 CTS |
3,045 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 13 (1 x 13) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
110-87-424-41-001101CONN IC DIP SOCKET 24POS GOLD |
3,448 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
06-2513-10TCONN IC DIP SOCKET 6POS GOLD |
3,101 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
06-0518-00CONN SOCKET SIP 6POS GOLD |
3,165 |
|
Datasheet |
518 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
06-1518-00CONN IC DIP SOCKET 6POS GOLD |
4,520 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
AR28-HZL/7/01-TTCONN IC DIP SOCKET 28POS GOLD |
2,104 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
116-83-306-41-002101CONN IC DIP SOCKET 6POS GOLD |
3,965 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
DIP628-011BDIP628-011B-DIP SOCKET 28 CTS |
2,509 |
|
Datasheet |
- | Bag | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
116-87-310-41-012101CONN IC DIP SOCKET 10POS GOLD |
4,652 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
110-87-322-41-001151CONN IC DIP SOCKET 22POS GOLD |
4,732 |
|
- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
06-0513-10TCONN SOCKET SIP 6POS GOLD |
4,701 |
|
Datasheet |
0513 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
01-0503-21CONN SOCKET SIP 1POS GOLD |
4,310 |
|
Datasheet |
0503 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | - | Wire Wrap | - | - | Gold | Polyamide (PA), Nylon, Glass Filled | 10.0µin (0.25µm) | Brass |
|
116-87-308-41-009101CONN IC DIP SOCKET 8POS GOLD |
2,446 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
1814640-2CONN IC DIP SOCKET 4POS GOLD |
3,304 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Polyester | 5.00µin (0.127µm) | Brass |
|
|
614-87-314-41-001101CONN IC DIP SOCKET 14POS GOLD |
4,181 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
02-0503-20CONN SOCKET SIP 2POS GOLD |
2,992 |
|
Datasheet |
0503 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
02-0503-30CONN SOCKET SIP 2POS GOLD |
3,420 |
|
Datasheet |
0503 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
09-0518-10TCONN SOCKET SIP 9POS GOLD |
3,122 |
|
Datasheet |
518 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
10-1518-10CONN IC DIP SOCKET 10POS GOLD |
3,349 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
A-CCS084-Z-SM/PSOCKET |
2,378 |
|
- |
- | Bulk | Active | PLCC | 84 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 160.0µin (4.06µm) | Phosphor Bronze |
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