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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    DIP632-011B

    DIP632-011B

    DIP632-011B-DIP SOCKET 32 CTS

    Amphenol ICC (FCI)

    		 4,745
    RFQ
    		DIP632-011B

    Datasheet

         		- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    A-CCS52-Z-R

    A-CCS52-Z-R

    CONN SOCKET PLCC 52POS TIN

    Assmann WSW Components

    		 4,625
    RFQ
    		A-CCS52-Z-R

    Datasheet

         		- Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    116-83-308-41-012101

    116-83-308-41-012101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 3,886
    RFQ
    		116-83-308-41-012101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-310-41-105191

    110-87-310-41-105191

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 3,558
    RFQ

    -

    		 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-3513-10

    06-3513-10

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 4,133
    RFQ
    		06-3513-10

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-308-41-001101

    116-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    		 4,989
    RFQ
    		116-87-308-41-001101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-314-41-105161

    110-87-314-41-105161

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    		 4,546
    RFQ
    		110-87-314-41-105161

    Datasheet

         		110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-11

    HLS-0102-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,763
    RFQ
    		HLS-0102-G-11

    Datasheet

         		HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0202-T-2

    HLS-0202-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,181
    RFQ
    		HLS-0202-T-2

    Datasheet

         		HLS Tube Active SIP 4 (2 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    02-0508-30

    02-0508-30

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    		 4,612
    RFQ
    		02-0508-30

    Datasheet

         		508 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    02-1508-30

    02-1508-30

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    		 2,515
    RFQ
    		02-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    917-83-104-41-053101

    917-83-104-41-053101

    CONN TRANSIST TO-5 4POS GOLD

    Preci-Dip

    		 2,741
    RFQ
    		917-83-104-41-053101

    Datasheet

         		917 Bulk Active Transistor, TO-5 4 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-2513-10

    06-2513-10

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 4,161
    RFQ
    		06-2513-10

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-6513-10T

    06-6513-10T

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 4,579
    RFQ
    		06-6513-10T

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-0518-10

    11-0518-10

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    		 2,412
    RFQ
    		11-0518-10

    Datasheet

         		518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0517-90C

    03-0517-90C

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    		 2,324
    RFQ
    		03-0517-90C

    Datasheet

         		0517 Bulk Active SIP 3 (1 x 3) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-210-41-003101

    116-87-210-41-003101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 2,383
    RFQ
    		116-87-210-41-003101

    Datasheet

         		116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-006101

    116-87-314-41-006101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    		 2,946
    RFQ
    		116-87-314-41-006101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-312-41-001101

    115-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    		 2,582
    RFQ

    -

    		 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-314-41-134191

    114-87-314-41-134191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    		 2,070
    RFQ
    		114-87-314-41-134191

    Datasheet

         		114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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