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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICA-308-ZSTT

    ICA-308-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,323
    RFQ
    ICA-308-ZSTT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    300-014-000

    300-014-000

    CONN SOCKET SIP 14POS GOLD

    3M

    3,825
    RFQ

    -

    300 - Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    13-0513-10

    13-0513-10

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,156
    RFQ
    13-0513-10

    Datasheet

    0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0518-10

    16-0518-10

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    4,302
    RFQ
    16-0518-10

    Datasheet

    518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    05-0517-90C

    05-0517-90C

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,044
    RFQ
    05-0517-90C

    Datasheet

    0517 Bulk Active SIP 5 (1 x 5) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-210-41-001101

    116-83-210-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,311
    RFQ
    116-83-210-41-001101

    Datasheet

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-310-41-001101

    116-83-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,425
    RFQ
    116-83-310-41-001101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-99-052-24-000000

    540-99-052-24-000000

    CONN SOCKET PLCC 52POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,191
    RFQ
    540-99-052-24-000000

    Datasheet

    540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    299-83-306-11-001101

    299-83-306-11-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,682
    RFQ
    299-83-306-11-001101

    Datasheet

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP640-001B

    DIP640-001B

    DIP640-001B-DIP SOCKET 40 CTS

    Amphenol ICC (FCI)

    2,833
    RFQ
    DIP640-001B

    Datasheet

    - Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    HLS-0103-G-31

    HLS-0103-G-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,124
    RFQ
    HLS-0103-G-31

    Datasheet

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    115-87-628-41-003101

    115-87-628-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,118
    RFQ
    115-87-628-41-003101

    Datasheet

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X19-160B

    SIP050-1X19-160B

    1X19-160B-SIP SOCKET 19 CTS

    Amphenol ICC (FCI)

    3,216
    RFQ
    SIP050-1X19-160B

    Datasheet

    SIP050-1x Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-310-41-004101

    116-87-310-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,730
    RFQ
    116-87-310-41-004101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-0513-10

    10-0513-10

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    2,997
    RFQ
    10-0513-10

    Datasheet

    0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3518-10T

    18-3518-10T

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,798
    RFQ
    18-3518-10T

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0106-T-2

    HLS-0106-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,996
    RFQ
    HLS-0106-T-2

    Datasheet

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    2-916783-5

    2-916783-5

    CONN SOCKET PGA ZIF 370POS GOLD

    TE Connectivity AMP Connectors

    3,585
    RFQ
    2-916783-5

    Datasheet

    - Tray Obsolete PGA, ZIF (ZIP) 370 (19 x 19) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    10-0513-11

    10-0513-11

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    3,939
    RFQ
    10-0513-11

    Datasheet

    0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-10T

    17-0518-10T

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,940
    RFQ
    17-0518-10T

    Datasheet

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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