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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-87-636-41-005101CONN IC DIP SOCKET 36POS GOLD |
4,347 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
SIP050-1X23-157B1X23-157B-SIP SOCKET 23 CTS |
4,259 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 23 (1 x 23) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
116-87-312-41-011101CONN IC DIP SOCKET 12POS GOLD |
3,255 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
12-3513-10TCONN IC DIP SOCKET 12POS GOLD |
4,499 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
612-87-324-41-001101CONN IC DIP SOCKET 24POS GOLD |
4,729 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-83-422-41-005101CONN IC DIP SOCKET 22POS GOLD |
2,147 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-83-422-41-605101CONN IC DIP SOCKET 22POS GOLD |
3,549 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
116-87-322-41-018101CONN IC DIP SOCKET 22POS GOLD |
3,306 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HLS-0103-G-38.100" SCREW MACHINE SOCKET ARRAY |
3,881 |
|
Datasheet |
HLS | Tube | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
211-1-40-006CONN IC DIP SOCKET 40POS GOLD |
4,485 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
122-83-312-41-001101CONN IC DIP SOCKET 12POS GOLD |
2,783 |
|
Datasheet |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
643647-1CONN SOCKET SIP 15POS TIN |
4,463 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 15 (1 x 15) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
510-83-028-06-001101CONN SOCKET PGA 28POS GOLD |
2,961 |
|
Datasheet |
510 | Bulk | Active | PGA | 28 (6 x 6) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
643653-1CONN SOCKET SIP 21POS TIN |
2,419 |
|
- |
Diplomate DL | Box | Obsolete | SIP | 21 (1 x 21) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
110-87-320-41-105191CONN IC DIP SOCKET 20POS GOLD |
4,212 |
|
- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
822516-5CONN SOCKET PLCC 68POS TIN |
2,801 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
|
114-83-316-41-134191CONN IC DIP SOCKET 16POS GOLD |
2,372 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
808-AG11DCONN IC DIP SOCKET 8POS GOLD |
4,456 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
2-1571550-3CONN IC DIP SOCKET 14POS GOLD |
4,165 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Beryllium Copper |
|
508-AG10D-ESCONN IC DIP SOCKET 8POS GOLD |
2,454 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester | 25.0µin (0.63µm) | Copper Alloy |
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