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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    116-83-314-41-002101

    116-83-314-41-002101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,922
    RFQ
    116-83-314-41-002101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    110-83-428-41-001101

    110-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,789
    RFQ
    110-83-428-41-001101

    Datasheet

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    16-0513-10

    16-0513-10

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    3,183
    RFQ
    16-0513-10

    Datasheet

    0513 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    19-0518-10H

    19-0518-10H

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,546
    RFQ
    19-0518-10H

    Datasheet

    518 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    123-87-320-41-001101

    123-87-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,183
    RFQ
    123-87-320-41-001101

    Datasheet

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    D95022-42

    D95022-42

    CONN IC DIP SOCKET 22POS GOLD

    Harwin Inc.

    2,275
    RFQ
    D95022-42

    Datasheet

    D95 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
    116-87-424-41-018101

    116-87-424-41-018101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,829
    RFQ
    116-87-424-41-018101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    612-83-318-41-001101

    612-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,320
    RFQ
    612-83-318-41-001101

    Datasheet

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    ICF-314-STL-O-TR

    ICF-314-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,115
    RFQ
    ICF-314-STL-O-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    BU180Z-178-HT

    BU180Z-178-HT

    CONN IC DIP SOCKET 18POS GOLD

    On Shore Technology Inc.

    2,610
    RFQ
    BU180Z-178-HT

    Datasheet

    BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
    614-87-624-31-012101

    614-87-624-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,709
    RFQ
    614-87-624-31-012101

    Datasheet

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    116-87-314-41-011101

    116-87-314-41-011101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,712
    RFQ
    116-87-314-41-011101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    116-87-312-41-004101

    116-87-312-41-004101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,431
    RFQ
    116-87-312-41-004101

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    346-43-105-41-013000

    346-43-105-41-013000

    CONN SOCKET SIP 5POS GOLD

    Mill-Max Manufacturing Corp.

    3,020
    RFQ
    346-43-105-41-013000

    Datasheet

    346 Tube Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    ICA-314-ZSTT

    ICA-314-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,809
    RFQ
    ICA-314-ZSTT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
    110-83-320-41-105101

    110-83-320-41-105101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,983
    RFQ
    110-83-320-41-105101

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    114-83-422-41-117101

    114-83-422-41-117101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,490
    RFQ
    114-83-422-41-117101

    Datasheet

    114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    12-0513-10

    12-0513-10

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,497
    RFQ
    12-0513-10

    Datasheet

    0513 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    HLS-0108-S-2

    HLS-0108-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,017
    RFQ
    HLS-0108-S-2

    Datasheet

    HLS Bulk Active SIP 8 (1 x 8) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    110-87-642-41-005101

    110-87-642-41-005101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,594
    RFQ
    110-87-642-41-005101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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