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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-0518-11

    16-0518-11

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 3,594
    RFQ
    		16-0518-11

    Datasheet

         		518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-1518-11

    16-1518-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,478
    RFQ
    		16-1518-11

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-308-CTT

    ICO-308-CTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,608
    RFQ
    		ICO-308-CTT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    540-88-044-24-008

    540-88-044-24-008

    CONN SOCKET PLCC 44POS TIN

    Preci-Dip

    		 3,607
    RFQ
    		540-88-044-24-008

    Datasheet

         		540 Bulk Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    APH-0902-T-H

    APH-0902-T-H

    APH-0902-T-H

    Samtec Inc.

    		 2,212
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1502-T-H

    APH-1502-T-H

    APH-1502-T-H

    Samtec Inc.

    		 4,238
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1902-T-H

    APH-1902-T-H

    APH-1902-T-H

    Samtec Inc.

    		 3,555
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1102-T-H

    APH-1102-T-H

    APH-1102-T-H

    Samtec Inc.

    		 3,059
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1602-T-H

    APH-1602-T-H

    APH-1602-T-H

    Samtec Inc.

    		 2,633
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0702-T-H

    APH-0702-T-H

    APH-0702-T-H

    Samtec Inc.

    		 4,986
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0302-T-H

    APH-0302-T-H

    APH-0302-T-H

    Samtec Inc.

    		 3,031
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0402-T-H

    APH-0402-T-H

    APH-0402-T-H

    Samtec Inc.

    		 4,198
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0802-T-H

    APH-0802-T-H

    APH-0802-T-H

    Samtec Inc.

    		 3,897
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1702-T-H

    APH-1702-T-H

    APH-1702-T-H

    Samtec Inc.

    		 4,892
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1802-T-H

    APH-1802-T-H

    APH-1802-T-H

    Samtec Inc.

    		 4,767
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-83-318-41-003101

    116-83-318-41-003101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    		 4,156
    RFQ
    		116-83-318-41-003101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-316-41-001101

    122-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    		 4,482
    RFQ
    		122-83-316-41-001101

    Datasheet

         		122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1825094-7

    1-1825094-7

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    		 4,940
    RFQ
    		1-1825094-7

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825109-1

    1-1825109-1

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    		 3,251
    RFQ
    		1-1825109-1

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    116-87-624-41-003101

    116-87-624-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 2,438
    RFQ
    		116-87-624-41-003101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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