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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1302-T-H

    APH-1302-T-H

    APH-1302-T-H

    Samtec Inc.

    		 3,213
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    614-83-324-31-012101

    614-83-324-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 3,816
    RFQ
    		614-83-324-31-012101

    Datasheet

         		614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-424-31-012101

    614-83-424-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 4,442
    RFQ
    		614-83-424-31-012101

    Datasheet

         		614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-066-11-002101

    510-87-066-11-002101

    CONN SOCKET PGA 66POS GOLD

    Preci-Dip

    		 2,758
    RFQ
    		510-87-066-11-002101

    Datasheet

         		510 Bulk Active PGA 66 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-0513-11

    14-0513-11

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    		 4,467
    RFQ
    		14-0513-11

    Datasheet

         		0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0513-10H

    16-0513-10H

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 3,059
    RFQ
    		16-0513-10H

    Datasheet

         		0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0513-10

    22-0513-10

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 2,895
    RFQ
    		22-0513-10

    Datasheet

         		0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0106-T-11

    HLS-0106-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,297
    RFQ
    		HLS-0106-T-11

    Datasheet

         		HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    115-87-650-41-001101

    115-87-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 2,799
    RFQ

    -

    		 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-424-41-008101

    116-87-424-41-008101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 2,107
    RFQ
    		116-87-424-41-008101

    Datasheet

         		116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-009101

    116-83-318-41-009101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    		 3,140
    RFQ
    		116-83-318-41-009101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-007101

    116-83-320-41-007101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    		 4,376
    RFQ
    		116-83-320-41-007101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-424-41-018101

    116-83-424-41-018101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 4,461
    RFQ
    		116-83-424-41-018101

    Datasheet

         		116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1825532-1

    1825532-1

    CONN SOCKET SIP 16POS GOLD

    TE Connectivity AMP Connectors

    		 4,177
    RFQ
    		1825532-1

    Datasheet

         		510 - Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Thermoplastic, Polyester -
    510-87-075-11-001101

    510-87-075-11-001101

    CONN SOCKET PGA 75POS GOLD

    Preci-Dip

    		 2,502
    RFQ
    		510-87-075-11-001101

    Datasheet

         		510 Bulk Active PGA 75 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-3503-20

    06-3503-20

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 3,981
    RFQ
    		06-3503-20

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-3503-30

    06-3503-30

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 4,395
    RFQ
    		06-3503-30

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-3518-01

    06-3518-01

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 2,033
    RFQ
    		06-3518-01

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0204-T-10

    HLS-0204-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,981
    RFQ
    		HLS-0204-T-10

    Datasheet

         		HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-83-210-10-001101

    299-83-210-10-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    		 2,805
    RFQ
    		299-83-210-10-001101

    Datasheet

         		299 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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