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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    HLS-2007-T-10

    HLS-2007-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,110
    RFQ
    HLS-2007-T-10

    Datasheet

    HLS Bulk Active SIP 140 (20 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    116-83-316-41-001101

    116-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,928
    RFQ
    116-83-316-41-001101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    121-83-320-41-001101

    121-83-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,309
    RFQ
    121-83-320-41-001101

    Datasheet

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    114-83-628-41-134161

    114-83-628-41-134161

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,761
    RFQ
    114-83-628-41-134161

    Datasheet

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    04-0503-31

    04-0503-31

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,881
    RFQ
    04-0503-31

    Datasheet

    0503 Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    146-87-422-41-035101

    146-87-422-41-035101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,118
    RFQ
    146-87-422-41-035101

    Datasheet

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    146-87-422-41-036101

    146-87-422-41-036101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,951
    RFQ
    146-87-422-41-036101

    Datasheet

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    116-87-420-41-009101

    116-87-420-41-009101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,401
    RFQ
    116-87-420-41-009101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    HLS-0203-T-32

    HLS-0203-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,152
    RFQ
    HLS-0203-T-32

    Datasheet

    HLS Tube Active SIP 6 (2 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    110-87-428-41-105101

    110-87-428-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,557
    RFQ
    110-87-428-41-105101

    Datasheet

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    116-87-424-41-002101

    116-87-424-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,330
    RFQ
    116-87-424-41-002101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-065-10-051101

    510-87-065-10-051101

    CONN SOCKET PGA 65POS GOLD

    Preci-Dip

    3,978
    RFQ
    510-87-065-10-051101

    Datasheet

    510 Bulk Active PGA 65 (10 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-065-10-052101

    510-87-065-10-052101

    CONN SOCKET PGA 65POS GOLD

    Preci-Dip

    4,899
    RFQ
    510-87-065-10-052101

    Datasheet

    510 Bulk Active PGA 65 (10 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    A-ICS-254-18-TT50

    A-ICS-254-18-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,561
    RFQ
    A-ICS-254-18-TT50

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
    ICF-320-TL-O-TR

    ICF-320-TL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,106
    RFQ
    ICF-320-TL-O-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    HLS-0107-T-11

    HLS-0107-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,848
    RFQ
    HLS-0107-T-11

    Datasheet

    HLS Tube Active SIP 7 (1 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    AR 36-HZL/07-TT

    AR 36-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,925
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
    116-87-432-41-018101

    116-87-432-41-018101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,080
    RFQ
    116-87-432-41-018101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    612-83-324-41-001101

    612-83-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,623
    RFQ
    612-83-324-41-001101

    Datasheet

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    HLS-0108-T-2

    HLS-0108-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,875
    RFQ
    HLS-0108-T-2

    Datasheet

    HLS Tube Active SIP 8 (1 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
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