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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-0518-10

    30-0518-10

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 3,528
    RFQ
    		30-0518-10

    Datasheet

         		518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0517-90C

    08-0517-90C

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 2,712
    RFQ
    		08-0517-90C

    Datasheet

         		0517 Bulk Active SIP 8 (1 x 8) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    122-83-320-41-001101

    122-83-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    		 3,979
    RFQ
    		122-83-320-41-001101

    Datasheet

         		122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-422-41-007101

    116-87-422-41-007101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    		 3,759
    RFQ
    		116-87-422-41-007101

    Datasheet

         		116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/07/7-TT

    AR 22-HZL/07/7-TT

    SOCKET

    Assmann WSW Components

    		 4,859
    RFQ

    -

    		 AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-87-648-41-001101

    110-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    		 2,014
    RFQ
    		110-87-648-41-001101

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-648-41-001151

    110-87-648-41-001151

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    		 2,495
    RFQ

    -

    		 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-422-41-001101

    612-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    		 4,435
    RFQ
    		612-83-422-41-001101

    Datasheet

         		612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-432-31-012101

    614-87-432-31-012101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 3,689
    RFQ
    		614-87-432-31-012101

    Datasheet

         		614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0205-T-2

    HLS-0205-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,141
    RFQ
    		HLS-0205-T-2

    Datasheet

         		HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0105-G-11

    HLS-0105-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,636
    RFQ
    		HLS-0105-G-11

    Datasheet

         		HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    AR 28-HZL/07/7-TT

    AR 28-HZL/07/7-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    		 4,760
    RFQ
    		AR 28-HZL/07/7-TT

    Datasheet

         		- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    146-87-322-41-036101

    146-87-322-41-036101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    		 4,888
    RFQ
    		146-87-322-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0902-T-T

    APH-0902-T-T

    APH-0902-T-T

    Samtec Inc.

    		 2,159
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1402-T-T

    APH-1402-T-T

    APH-1402-T-T

    Samtec Inc.

    		 3,134
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1202-T-T

    APH-1202-T-T

    APH-1202-T-T

    Samtec Inc.

    		 4,195
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0802-T-T

    APH-0802-T-T

    APH-0802-T-T

    Samtec Inc.

    		 3,570
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1702-T-T

    APH-1702-T-T

    APH-1702-T-T

    Samtec Inc.

    		 3,264
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    08-3518-10E

    08-3518-10E

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,610
    RFQ
    		08-3518-10E

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-87-632-41-105191

    110-87-632-41-105191

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 3,260
    RFQ

    -

    		 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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