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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
16-0513-11CONN SOCKET SIP 16POS GOLD |
3,468 |
|
Datasheet |
0513 | Bulk | Active | SIP | 16 (1 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
06-0503-20CONN SOCKET SIP 6POS GOLD |
2,559 |
|
Datasheet |
0503 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
06-0503-30CONN SOCKET SIP 6POS GOLD |
3,392 |
|
Datasheet |
0503 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
18-3518-00CONN IC DIP SOCKET 18POS GOLD |
4,284 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
15-0518-00CONN SOCKET SIP 15POS GOLD |
3,243 |
|
Datasheet |
518 | Bulk | Active | SIP | 15 (1 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
2-1814640-5CONN IC DIP SOCKET 20POS GOLD |
4,362 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Polyester | 30.0µin (0.76µm) | Brass |
|
|
212-1-18-003CONN IC DIP SOCKET 18POS GOLD |
4,080 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
|
SIP050-1X32-160B1X32-160B-SIP SOCKET 32 CTS |
2,315 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 32 (1 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
116-83-420-41-012101CONN IC DIP SOCKET 20POS GOLD |
3,335 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
116-83-318-41-008101CONN IC DIP SOCKET 18POS GOLD |
4,732 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
146-83-318-41-035101CONN IC DIP SOCKET 18POS GOLD |
2,653 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
146-83-318-41-036101CONN IC DIP SOCKET 18POS GOLD |
3,071 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
346-43-107-41-013000CONN SOCKET SIP 7POS GOLD |
2,397 |
|
Datasheet |
346 | Bulk | Active | SIP | 7 (1 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
APA-308-T-MADAPTER PLUG |
3,771 |
|
Datasheet |
APA | Tube | Active | - | 8 (2 x 4) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
|
510-87-064-10-051101CONN SOCKET PGA 64POS GOLD |
3,662 |
|
Datasheet |
510 | Bulk | Active | PGA | 64 (10 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
116-83-424-41-006101CONN IC DIP SOCKET 24POS GOLD |
4,997 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
824-AG11D-ESCONN IC DIP SOCKET 24POS GOLD |
2,996 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
540-44-052-17-400000CONN SOCKET PLCC 52POS TIN |
3,992 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 52 (4 x 13) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Copper Alloy |
|
|
122-83-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
2,969 |
|
Datasheet |
122 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
123-83-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
3,872 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
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