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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
822472-7CONN SOCKET PLCC 84POS TIN-LEAD TE Connectivity AMP Connectors |
2,388 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin-Lead | - | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Thermoplastic | - | Phosphor Bronze |
|
643648-1CONN SOCKET SIP 16POS TIN TE Connectivity AMP Connectors |
4,242 |
|
- |
Diplomate DL | Tray | Obsolete | SIP | 16 (1 x 16) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
643652-3CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
3,771 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 20 (1 x 20) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
|
1571539-1CONN SOCKET PLCC 20POS TIN TE Connectivity AMP Connectors |
3,098 |
|
Datasheet |
- | Bulk | Obsolete | PLCC | 20 (4 x 5) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 180.0µin (4.57µm) | Copper Alloy |
|
2-640358-2CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,080 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
643642-2CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
3,165 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 10 (1 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
814-AG11D-ESLCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,819 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
1814640-6CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
3,654 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Polyester | Flash | Brass |
|
2-1437539-9CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,116 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
|
516-AG11D-ESDIP SOCKET T/H 16POS TE Connectivity AMP Connectors |
4,765 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
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