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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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814-AG11D-ESCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
4,068 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
1-1814640-7CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
2,712 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Polyester | 5.00µin (0.127µm) | Brass |
|
|
5-1437539-3CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,748 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
508-AG10D-ESLCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,221 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | - | 5.00µin (0.127µm) | Brass |
|
|
643644-6CONN SOCKET SIP 12POS TIN TE Connectivity AMP Connectors |
4,132 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
2-640361-2CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,848 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Beryllium Copper |
|
|
9-1437535-4CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
2,345 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | - | 25.0µin (0.63µm) | Beryllium Copper |
|
|
2-916783-5CONN SOCKET PGA ZIF 370POS GOLD TE Connectivity AMP Connectors |
3,585 |
|
Datasheet |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Liquid Crystal Polymer (LCP) | 15.0µin (0.38µm) | Phosphor Bronze |
|
1571539-2CONN SOCKET PLCC 28POS TIN TE Connectivity AMP Connectors |
3,508 |
|
Datasheet |
- | Bulk | Obsolete | PLCC | 28 (4 x 7) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 180.0µin (4.57µm) | Copper Alloy |
|
818-AG11D-ESCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
3,706 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
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