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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1-822473-6CONN SOCKET PLCC 68POS TIN TE Connectivity AMP Connectors |
3,191 |
|
Datasheet |
- | Box | Obsolete | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic | - |
|
2-1571586-3CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,150 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
828-AG11D-ESLCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
4,819 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
1-822473-7CONN SOCKET PLCC 84POS TIN TE Connectivity AMP Connectors |
3,471 |
|
Datasheet |
- | Box | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
|
822-AG11D-ESL-LFCONN IC DIP SOCKET 22POS GOLD TE Connectivity AMP Connectors |
3,629 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
1-1825094-7CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
4,940 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
1-1825109-1CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,251 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
|
210748-5CONN SOCKET PGA 6POS TIN-LEAD TE Connectivity AMP Connectors |
3,439 |
|
Datasheet |
- | Tube | Obsolete | PGA | 6 (2 x 3) | 0.100" (2.54mm) | Tin-Lead | 196.9µin (5.00µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | Thermoplastic, Polyester, Glass Filled | - |
|
|
516-AG10D-ESLCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,306 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
3-822516-1CONN SOCKET PLCC 44POS TIN TE Connectivity AMP Connectors |
4,349 |
|
Datasheet |
- | Tape & Reel (TR) | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
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