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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    2-382470-4

    2-382470-4

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    		 3,426
    RFQ
    		2-382470-4

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    345725-5

    345725-5

    CONN IC DIP SOCKET 22POS TINLEAD

    TE Connectivity AMP Connectors

    		 2,824
    RFQ

    -

    		 - Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin-Lead - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - - - -
    824-AG31D-ESL-LF

    824-AG31D-ESL-LF

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    		 4,502
    RFQ
    		824-AG31D-ESL-LF

    Datasheet

         		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    1-1437537-9

    1-1437537-9

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    		 4,282
    RFQ
    		1-1437537-9

    Datasheet

         		800 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - - -
    1-1437542-1

    1-1437542-1

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    		 2,615
    RFQ
    		1-1437542-1

    Datasheet

         		700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
    832-AG11D-ESL

    832-AG11D-ESL

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    		 3,193
    RFQ
    		832-AG11D-ESL

    Datasheet

         		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    3-1437535-4

    3-1437535-4

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    		 4,525
    RFQ
    		3-1437535-4

    Datasheet

         		500 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
    5-1571552-0

    5-1571552-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    		 3,298
    RFQ
    		5-1571552-0

    Datasheet

         		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    4-1571551-6

    4-1571551-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    		 3,076
    RFQ
    		4-1571551-6

    Datasheet

         		500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2-1571551-4

    2-1571551-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    		 2,337
    RFQ
    		2-1571551-4

    Datasheet

         		500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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