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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1571541-3CONN SOCKET PLCC 68POS TIN TE Connectivity AMP Connectors |
3,686 |
|
Datasheet |
PCS | Bulk | Obsolete | PLCC | 68 (4 x 17) | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | - |
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|
514-AG12D-LFCONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors |
2,897 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
828-AG12D-ES-LFCONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
2,451 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole, Right Angle, Vertical | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
643650-6CONN SOCKET SIP 18POS TIN TE Connectivity AMP Connectors |
4,932 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
|
518-AG11D-ESCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
2,637 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 25.0µin (0.63µm) | Beryllium Copper | Polyester | -55°C ~ 125°C |
|
|
1-1571552-2CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
3,785 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
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6-1437529-6CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
3,385 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 47.2µin (1.20µm) | Copper Alloy | Thermoplastic, Polyester | -55°C ~ 105°C |
|
|
643655-8CONN SOCKET SIP 23POS TIN TE Connectivity AMP Connectors |
4,780 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 23 (1 x 23) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
|
1437540-2CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,190 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
2-1814640-6CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors |
2,871 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
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