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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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840-AG11D-ESL-LFCONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
2,563 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Copper |
|
|
1571552-8CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors |
3,163 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Copper |
|
|
3-1437537-5CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
4,610 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
|
516-AG11DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
2,304 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
528-AG12D-LFCONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
2,907 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Beryllium Copper |
|
|
1571994-8CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
4,282 |
|
Datasheet |
510 | Tube | Obsolete | SIP | 10 (1 x 10) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Thermoplastic, Polyester | 20.0µin (0.51µm) | Copper |
|
|
2-1571586-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
2,314 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Copper |
|
|
6-1437535-3CONN SOCKET SIP 8POS GOLD TE Connectivity AMP Connectors |
4,394 |
|
Datasheet |
500 | Tube | Obsolete | SIP | 8 (1 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Thermoplastic | 10.0µin (0.25µm) | Beryllium Copper |
|
|
7-1437536-2CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors |
2,327 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
|
|
528-AG11D-ESLCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
4,681 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polyester | 5.00µin (0.127µm) | Brass, Copper |
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