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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3-1571586-2CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
2,259 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Copper |
|
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3-1437538-2CONN IC DIP SOCKET 40POS TINLEAD TE Connectivity AMP Connectors |
4,741 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
|
824-AG11DCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,413 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
8058-1G24CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
2,107 |
|
Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | Gold | - | Beryllium Copper | Panel Mount | - | - | Solder Cup | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Brass |
|
|
8060-1G13CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
2,778 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
2-1571550-9CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
4,675 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Beryllium Copper |
|
|
8058-1G32CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
3,317 |
|
Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Brass |
|
|
514-AG7DCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,384 |
|
- |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | - | 25.0µin (0.63µm) | Brass |
|
|
864-AG11D-ESLCONN IC DIP SOCKET 64POS GOLD TE Connectivity AMP Connectors |
4,406 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
|
808-AG12SMCONN IC DIP SOCKET 8POS TIN-LEAD TE Connectivity AMP Connectors |
2,315 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
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