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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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524-AG10D-ESCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
4,460 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
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2-1437542-2CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
2,594 |
|
Datasheet |
700 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Carrier, Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Aluminum Alloy | 20.0µin (0.51µm) | Beryllium Copper |
|
|
816-AG10DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,748 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
|
528-AG10D-ESCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
4,834 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
|
|
848-AG11D-ESCONN IC DIP SOCKET 48POS GOLD TE Connectivity AMP Connectors |
3,744 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
5-1437536-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
4,393 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
|
|
916657-3CONN SOCKET PGA ZIF 321POS GOLD TE Connectivity AMP Connectors |
3,124 |
|
Datasheet |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 321 (19 x 19) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Liquid Crystal Polymer (LCP) | 30.0µin (0.76µm) | Phosphor Bronze |
|
|
8080-1G13CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors |
2,427 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin-Lead | - | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
2-1437542-7CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
4,111 |
|
Datasheet |
700 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Aluminum Alloy | 20.0µin (0.51µm) | Beryllium Copper |
|
|
7-1437529-6CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,334 |
|
- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | - | - | Copper Alloy |
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