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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    514-AG11D-ES

    514-AG11D-ES

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,128
    RFQ
    514-AG11D-ES

    Datasheet

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy Polyester -55°C ~ 125°C
    643642-8

    643642-8

    CONN SOCKET SIP 10POS TIN

    TE Connectivity AMP Connectors

    2,841
    RFQ
    643642-8

    Datasheet

    Diplomate DL Tray Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    508-AG11D-ES

    508-AG11D-ES

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,822
    RFQ
    508-AG11D-ES

    Datasheet

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    1-1825094-3

    1-1825094-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,586
    RFQ
    1-1825094-3

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-1571551-2

    2-1571551-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,464
    RFQ
    2-1571551-2

    Datasheet

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2-1571550-2

    2-1571550-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,562
    RFQ
    2-1571550-2

    Datasheet

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1-1825094-4

    1-1825094-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,416
    RFQ
    1-1825094-4

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-640361-4

    2-640361-4

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    2,397
    RFQ
    2-640361-4

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
    1-1571995-0

    1-1571995-0

    CONN SOCKET SIP 10POS TIN

    TE Connectivity AMP Connectors

    2,735
    RFQ
    1-1571995-0

    Datasheet

    510 Tube Obsolete SIP 10 (2 x 5) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    816-AG11D-ES

    816-AG11D-ES

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,487
    RFQ
    816-AG11D-ES

    Datasheet

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
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